Imaging apparatus and electronic equipment

ABSTRACT

An imaging apparatus and electronic equipment configured for reduced power consumption are disclosed. In one example, an imaging apparatus includes a pixel array unit including a first pixel portion and a second pixel portion different from the first pixel portion. Each of the first pixel portion and the second pixel portion includes a first photoelectric conversion unit and a second photoelectric conversion unit adjacent to the first photoelectric conversion unit. The pixel array unit includes a first drive line connected to the first photoelectric conversion unit of the first pixel portion and the second pixel portion, a second drive line connected to the second photoelectric conversion unit of the first pixel portion, and a third drive line connected to the second photoelectric conversion unit of the second pixel portion. The t technology can, for example, be applied in a CMOS image sensor having pixels for phase difference detection.

TECHNICAL FIELD

The present technology relates to an imaging apparatus and electronicequipment, and particularly to an imaging apparatus and electronicequipment capable of reducing power consumption.

BACKGROUND ART

In recent years, a solid-state imaging element in which pixels for phasedifference detection are arranged in a pixel array unit has been used.

For example, a configuration is known in which in the pixels arranged inthe pixel array unit, by using a structure in which the photodiodes Aand B are provided under one microlens and using A+B signal as a signalfor image acquisition, and meanwhile each of the A signal and the Bsignal is used as a signal for phase difference detection (see, forexample, Patent Document 1).

CITATION LIST Patent Document Patent Document 1: Japanese PatentApplication Laid-Open No. 2016-105649 SUMMARY OF THE INVENTION Problemsto be Solved by the Invention

By the way, in a case where the structure in which the photodiodes A andB are provided under one microlens in the pixels is used, the number ofphotodiodes from which electric charges are read is doubled as comparedwith the structure in which one photodiode is provided, resulting in anincrease in power consumption.

With respect to such an increase in power consumption, in the techniquedisclosed in Patent Document 1 described above, in some of the pixels(including the photodiodes A and B) arranged in the pixel array unit,the A signal and the B signals are read separately, and only the A+Bsignal is read in the remaining pixels. However, in some pixels, it isnecessary to read the A signal and the B signal separately, and areduction in power consumption is insufficient, and a reduction in powerconsumption has been demanded.

The present technology has been made in view of such circumstances andenables reduction in power consumption.

Solutions to Problems

An imaging apparatus according to an aspect of the present technology isan imaging apparatus including: a pixel array unit including a firstpixel portion and a second pixel portion different from the first pixelportion; in which each of the first pixel portion and the second pixelportion includes a first photoelectric conversion unit and a secondphotoelectric conversion unit adjacent to the first photoelectricconversion unit, the pixel array unit includes a first drive lineconnected to the first photoelectric conversion unit of the first pixelportion and the second pixel portion, a second drive line connected tothe second photoelectric conversion unit of the first pixel portion, anda third drive line connected to the second photoelectric conversion unitof the second pixel portion.

Electronic equipment according to an aspect of the present technology iselectronic equipment including: an imaging unit including: a pixel arrayunit including a first pixel portion and a second pixel portiondifferent from the first pixel portion; in which each of the first pixelportion and the second pixel portion includes a first photoelectricconversion unit and a second photoelectric conversion unit adjacent tothe first photoelectric conversion unit, the pixel array unit includes afirst drive line connected to the first photoelectric conversion unit ofthe first pixel portion and the second pixel portion, a second driveline connected to the second photoelectric conversion unit of the firstpixel portion, and a third drive line connected to the secondphotoelectric conversion unit of the second pixel portion.

The imaging apparatus and the electronic equipment according to anaspect of the present technology include: a pixel array unit including afirst pixel portion and a second pixel portion different from the firstpixel portion; in which each of the first pixel portion and the secondpixel portion includes a first photoelectric conversion unit and asecond photoelectric conversion unit adjacent to the first photoelectricconversion unit, and the pixel array unit includes a first drive lineconnected to the first photoelectric conversion unit of the first pixelportion and the second pixel portion, a second drive line connected tothe second photoelectric conversion unit of the first pixel portion, anda third drive line connected to the second photoelectric conversion unitof the second pixel portion.

Effects of the Invention

According to one aspect of the present technology, it is possible toreduce power consumption.

Note that effects described herein are not necessarily limited, but mayalso be any of those described in the present disclosure.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a block diagram illustrating an example of a configuration ofan embodiment of a solid-state imaging element to which the presenttechnology has been applied.

FIG. 2 is a view illustrating an example of a structure of a dualPD-type pixel.

FIG. 3 is a table illustrating an example of driving pixels according toa first embodiment.

FIG. 4 is a graph indicating evaluation results of performance for eachtype of pixel.

FIG. 5 is a block diagram illustrating an example of a configuration ofan imaging apparatus according to a second embodiment.

FIG. 6 is a table illustrating an example of driving pixels according tothe second embodiment.

FIG. 7 is a block diagram illustrating an example of a configuration ofan imaging apparatus according to a third embodiment.

FIG. 8 is a table illustrating an example of driving pixels according tothe third embodiment.

FIG. 9 is a block diagram illustrating an example of a configuration ofan imaging apparatus according to a fourth embodiment.

FIG. 10 is a table illustrating an example of driving pixels accordingto the fourth embodiment.

FIG. 11 is a block diagram illustrating an example of a configuration ofan imaging apparatus according to a fifth embodiment.

FIG. 12 is a diagram illustrating a configuration of a current readfunction.

FIG. 13 is a diagram illustrating a configuration of a current readfunction.

FIG. 14 is a diagram illustrating a configuration of a read function ofthe present technology.

FIG. 15 is a diagram illustrating a configuration of a read function ofthe present technology.

FIG. 16 is a diagram illustrating an example of a structure of pixelshaving a 2×2 OCL structure.

FIG. 17 is a diagram illustrating a configuration of a current readfunction.

FIG. 18 is a diagram illustrating a configuration of a current readfunction.

FIG. 19 is a diagram illustrating a first configuration of a readfunction of the present technology.

FIG. 20 is a diagram illustrating the first configuration of a readfunction of the present technology.

FIG. 21 is a diagram illustrating a second configuration of a readfunction of the present technology.

FIG. 22 is a diagram illustrating the second configuration of the readfunction of the present technology.

FIG. 23 is a block diagram illustrating a configuration example ofelectronic equipment including a solid-state imaging element to whichthe present technology is applied.

FIG. 24 is a diagram illustrating a usage example of a solid-stateimaging element to which the present technology is applied.

FIG. 25 is a block diagram illustrating an example of a schematicconfiguration of a vehicle control system.

FIG. 26 is an explanatory diagram illustrating an example ofinstallation positions of a vehicle outside information detecting unitand an imaging unit.

FIG. 27 is a diagram illustrating an example of a schematicconfiguration of an endoscopic surgery system.

FIG. 28 is a block diagram illustrating an example of a functionconfiguration of a camera head and a CCU.

MODE FOR CARRYING OUT THE INVENTION

Embodiments of the present technology are described below with referenceto the drawings. Note that the description is given in the order below.

1. First Embodiment: Pixel structure and drive control thereof

2. Second embodiment: Another drive control

3. Third embodiment: Another drive control

4. Fourth embodiment: Another drive control

5. Fifth embodiment: Configuration including correction processing

6. Sixth embodiment: Read function of pixel

7. Seventh embodiment: Another pixel structure and read function thereof

8. Variation

9. Configuration of electronic equipment

10. Example of use of solid-state imaging element

11. Application examples to mobile objects

12. Application example to endoscopic surgery system

1. First Embodiment

(Configuration Example of Solid-State Imaging Element)

FIG. 1 is a block diagram illustrating an example of a configuration ofan embodiment of a solid-state imaging element to which the presenttechnology has been applied.

A solid-state imaging element 10 of FIG. 1 is configured as, forexample, a CMOS image sensor using complementary metal oxidesemiconductor (CMOS). The solid-state imaging element 10 takes inincident light (image light) from a subject through an optical lenssystem (not illustrated), converts the light amount of the incidentlight formed on an imaging surface into an electric signal on apixel-by-pixel basis, and outputs the electric signal as a pixel signal.

In FIG. 1, the solid-state imaging element 10 includes a pixel arrayunit 11, a vertical drive circuit 12, a column signal processing circuit13, a horizontal drive circuit 14, an output circuit 15, a controlcircuit 16, and an input/output terminal 17.

In the pixel array unit 11, a plurality of pixels 100 is arranged in atwo-dimensional form (matrix form).

The vertical drive circuit 12 is configured by, for example, a shiftregister, selects a predetermined pixel drive line 21, supplies a drivesignal (pulse) for driving the pixels 100 to the selected pixel driveline 21, and drives the pixels 100 in the unit of rows.

That is, the vertical drive circuit 12 sequentially selectively scanseach pixel 100 of the pixel array unit 11 in the unit of rows in thevertical direction, and supplies a pixel signal based on electriccharges (signal charges) generated corresponding to the received lightamount in the photodiode (photoelectric conversion unit) of each pixel100 to the column signal processing circuit 13 through a vertical signalline 22.

The column signal processing circuit 13 is arranged for each column ofthe pixels 100, and performs signal processing such as noise removal onthe signals output from the pixels 100 of one row with respect to eachpixel column. For example, the column signal processing circuit 13performs signal processing such as correlated double sampling (CDS) forremoving fixed pattern noise peculiar to pixels and analog digital (AD)conversion.

The horizontal drive circuit 14 includes, for example, a shift register,sequentially outputs horizontal scanning pulses to sequentially selecteach of the column signal processing circuits 13, and causes each of thecolumn signal processing circuits 13 to output a pixel signal to ahorizontal signal line 23.

The output circuit 15 performs signal processing on the signalssequentially supplied from each of the column signal processing circuits13 through the horizontal signal line 23, and outputs the processedsignals. Note that the output circuit 15 can be, for example, onlybuffered, or can be subjected to black level adjustment, columnvariation correction, various digital signal processing, and the like.

The control circuit 16 controls the operation of each unit of thesolid-state imaging element 10.

Furthermore, the control circuit 16 generates a clock signal or acontrol signal that serves as a reference for operations of the verticaldrive circuit 12, the column signal processing circuit 13, thehorizontal drive circuit 14, and the like on the basis of a verticalsynchronization signal, a horizontal synchronization signal, and amaster clock signal. The control circuit 16 outputs the generated clocksignal or control signal to the vertical drive circuit 12, the columnsignal processing circuit 13, the horizontal drive circuit 14, and thelike.

The input/output terminal 17 exchanges signals with the outside.

The solid-state imaging element 10 configured as described above is aCMOS image sensor that employs a system called a column AD system inwhich the column signal processing circuit 13 that performs the CDSprocessing and the AD conversion processing is arranged for each pixelcolumn. Furthermore, the solid-state imaging element 10 can be, forexample, a backside illumination-type CMOS image sensor.

(Example of Pixel Structure)

FIG. 2 is a view illustrating an example of a structure of a dualPD-type pixel.

A of FIG. 2 illustrates a plan view of pixels 100 in two rows and twocolumns (2×2) arranged in a predetermined imaging region when viewedfrom the light incident side among the plurality of pixels 100 arrangedin the pixel array unit 11. Furthermore, B of FIG. 2 illustrates a partof the X-X′ cross-section of the pixel 100 illustrated in A of FIG. 2.

As illustrated in FIG. 2, the pixel 100 includes a structure in which aphotodiode 112A and a photodiode 112B are provided in one on-chip lens111 (hereinafter, also referred to as a dual PD-type structure). Notethat the dual PD-type pixel 100 can be said to be a pixel portionincluding a left pixel 100A having a left photodiode 112A and a rightpixel 100B having a right photodiode 112B (first pixel portion or secondpixel portion). Furthermore, the on-chip lens is also called amicrolens.

In the dual PD-type pixel 100, a pixel signal (A+B signal) generated bysumming the electric charges accumulated in the photodiodes 112A and112B is used as a signal for image acquisition and the pixel signal (Asignal) obtained from the electric charges accumulated in the photodiode112A and the pixel signal (B signal) obtained from the electric chargesaccumulated in the photodiode 112B can be independently read and used asa signal for phase difference detection.

As described above, the pixel 100 has a dual PD-type structure, and canbe used for both purposes: a pixel for image acquisition (hereinafterreferred to as an image acquisition pixel) and a pixel for phasedifference detection (hereinafter referred to as a phase differencedetection pixel). Note that, although details will be described later,even a pixel signal obtained from a phase difference detection pixel canbe used as a signal for image acquisition by being subjected tocorrection processing.

Furthermore, as illustrated in the cross-sectional view of B of FIG. 2,the pixel 100 includes a color filter 113 below the on-chip lens 111,and is configured as an R pixel 100, a G pixel 100, or a B pixel 100depending on the wavelength component transmitted by the color filter113.

Note that the R pixel 100 is a pixel that generates an electric chargecorresponding to a red (R) component light from the light that haspassed through an R color filter 113 that transmits a red (R: Red)wavelength component. Furthermore, the G pixel 100 is a pixel thatgenerates an electric charge corresponding to a green (G) componentlight from the light that has passed through a G color filter 113 thattransmits a green (G: Green) wavelength component. Moreover, the B pixel100 is a pixel that generates an electric charge corresponding to a blue(B) component light from the light that has passed through a B colorfilter 113 that transmits a blue (B: Blue) wavelength component.

In the pixel array unit 11, the R pixels 100, the G pixels 100, and theB pixels 100 can be arranged in an arrangement pattern such as a Bayerarrangement. For example, in the plan view of A of FIG. 2, among the 2×2pixels 100, the upper left and lower right are G pixels 100, the lowerleft is the R pixel 100, and the upper right is the B pixel 100.

By the way, as a structure of the phase difference detection pixel,there is a shield-type structure. The shield-type pixel includes astructure in which a light-shielding portion including a metal such astungsten (W) or aluminium (Al) is provided under the on-chip lens andthis light-shielding portion shields the light for the left side regionor the right side region when viewed from the light incident side. Then,in the pixel array unit, by disposing the left light-shielding pixelsand the right light-shielding pixels having such a structure in ascattered manner, a left light-shielding pixel signal and a rightlight-shielding pixel signal are obtained as signals for phasedifference detection.

Here, in the dual PD-type pixel illustrated in FIG. 2, in a case whereeither one of the electric charge accumulated in the photodiode 112A andthe electric charge accumulated in the photodiode 112B is independentlyread, a pixel signal similar to the shield-type pixel can be obtained.That is, the pixel signal (A signal) corresponding to the rightlight-shielding pixel signal is obtained from the electric chargegenerated by the photodiode 112A, and the pixel signal (B signal)corresponding to the left light-shielding pixel signal is obtained fromthe electric charge generated by the photodiode 112B.

In the present technology, by utilizing the feature of such a dualPD-type pixel, some of the pixels 100 arranged in the pixel array unit11 are configured to independently read at least one electric charge ofthe electric charge accumulated in the photodiode 112A or the electriccharge accumulated in the photodiode 112B, and thus, as compared withthe case where the reading configuration disclosed in Patent Document 1described above is adopted, lower power consumption can be achieved.

Specifically, with the configuration disclosed in Patent Document 1described above, in order to obtain a signal for phase differencedetection, in part, the A signal and the B signal from the photodiodes Aand B need to be separately read (reading twice). However, with theconfiguration of the present technology, one-time reading of thephotodiodes 112A and 112B suffices, and thus it is possible to achievelower power consumption because of the reduced number of times ofreading.

However, the dual PD-type pixel has improved performance in lowilluminance as compared with the shield-type pixel, but the accuracy ofphase difference detection is lower than that in high illuminance.Therefore, for example, it is necessary to enable the signals for phasedifference detection to be eventually obtained in all the pixelsarranged in the pixel array unit 11 in association with a gain set inthe solid-state imaging element 10.

For example, as illustrated in FIG. 3, in a case where the gain set inthe solid-state imaging element 10 is smaller than a first thresholdvalue Th1, a drive control A is selected as a drive control method, andamong all the pixels arranged in the pixel array unit 11, one of thephotodiode 112A and the photodiode 112B is independently read in 3% ofthe pixels 100. At this time, 3% of the pixels 100 are used as the phasedifference detection pixels, and in the remaining 97% of the pixels 100,both the photodiodes 112A and 112B are read and used as the imageacquisition pixels.

Furthermore, for example, as illustrated in FIG. 3, in a case where thegain is larger than the first threshold value Th1 and smaller than asecond threshold value Th2, a drive control B is selected, and among allthe pixels arranged in the pixel array unit 11, one of the photodiode112A and the photodiode 112B is independently read in 6% of the pixels100. At this time, 6% of the pixels 100 are used as the phase differencedetection pixels, and the remaining 94% of the pixels 100 are used asthe image acquisition pixels.

Moreover, for example, as illustrated in FIG. 3, in a case where thegain is larger than the second threshold value Th2, a drive control C isselected, and in all the pixels arranged in the pixel array unit 11, thephotodiodes 112A and 112B are read and signals for phase differencedetection and signals for image acquisition are obtained. At this time,all the pixels (100% of the pixels) are used as the phase differencedetection pixels and the image acquisition pixels.

Here, the gain set in the solid-state imaging element 10 is determinedby detecting the average luminance on the basis of the output signaloutput from the solid-state imaging element 10. That is, the gain has asmaller value as the illuminance in the imaging region of the pixelarray unit 11 increases. For example, when the illuminance is 1.25, 10,20, 80 lux (lx), the gains are set to 60, 42, 36, and 24 dB,respectively, and when the illuminance exceeds 1280 lux (lx), the gainis set to 0 dB.

As described above, in the present technology, threshold valuedetermination with respect to the gain set in the solid-state imagingelement 10 is performed, and on the basis of results of thedetermination, among the pixels 100 arranged in the pixel array unit 11,in a predetermined density (for example, 3%, 6%, or the like) of thepixels 100, one of the photodiode 112A and the photodiode 112B is set toan independently read target.

Note that, for example, in a case where the gain is larger than thesecond threshold value Th2, the photodiodes 112A and 112B are read inall the pixels (100% of the pixels), but at normal illuminance, the gainwill not be larger than the second threshold value Th2 (the secondthreshold value Th2 is set accordingly), the photodiodes 112A and 112Bwill not be read in all the pixels. That is, under normal illuminanceconditions (for example, illuminance of 10 lux or more or 20 lux ormore), the photodiode 112 only needs to be read once to obtain a signalfor phase difference detection, and thus lower power consumption can beachieved.

Furthermore, as illustrated in FIG. 3, for example, comparing the drivecontrol C with the drive control A and B, the power consumption isincreased by 50%, but under normal illuminance conditions (e.g.,illuminance of 10 lux or more or 20 or more), lower power consumptioncan be achieved.

Moreover, as illustrated in FIG. 3, maximum frame rates in a case wheredriving by the drive control A, the drive control B, and the drivecontrol C is performed are 1000 fps, 1000 fps, and 500 fps,respectively. However, for example, in a case where driving by the drivecontrol A and the drive control B is performed, as compared with thecase where driving by the drive control C is performed, the frame ratecan be increased and thus slow motion of 1000 fps or the like can beachieved.

Note that, in FIG. 3, an example is illustrated in which two thresholdvalues (first threshold value Th1 and second threshold value Th2) areset and the pixels 100 arranged in the pixel array unit 11 are driven bythe drive control methods in three stages (drive control A, B, C), butthe number of threshold values is not limited thereto, and, for example,one threshold value may be provided and drive control may be performedin two stages or three or more threshold values may be provided anddrive control may be performed in four or more stages. Moreover, thedensity of the phase difference detection pixels such as 3% and 6% is anexample, and an arbitrary density (for example, a density that increasesaccording to the gain) can be set for each drive control method at eachstage.

Furthermore, in the above description, an example is illustrated inwhich in a case where the pixel 100 is used as a phase differencedetection pixel, one of the photodiode 112A and the photodiode 112B isindependently read, but the photodiode 112A and the photodiode 112B maybe independently read. For example, in the drive control B illustratedin FIG. 3, in a case where the density of the phase difference detectionpixels is low such as when the density of the pixels 100 used as thephase difference detection pixels is 6%, the photodiode 112A and thephotodiode 112B may be independently read and the pixel signals (Asignal and B signal) may be obtained. However, these reading methods canbe changed for each drive control method at each stage.

Furthermore, in a case where imaging is performed a plurality of times,a hysteresis may be provided for the threshold value, and for example,in comparing the set gain and the threshold value, even when thethreshold value is changed a bit at a stage where the gain first exceedsthe threshold value and the gain obtained thereafter varies to someextent, the gain may be kept above the threshold value. By providingsuch hysteresis, it is possible to prevent excessive switching of thedistance measurement methods.

(Performance Difference Between Types of Pixel)

FIG. 4 illustrates a graph illustrating evaluation results of theperformance for each type of pixel.

In FIG. 4, the horizontal axis represents gain (unit: dB), and the valueincreases from the left side to the right side in the drawing.Furthermore, the vertical axis represents variation (σ) (unit: μm) inphase difference detection, meaning that the variation increases towardthe upper side in the drawing.

In FIG. 4, a curve C1 illustrates the characteristics of a dual PD-typepixel, and a curve C2 illustrates the characteristics of a shield-typepixel.

Here, for example, focusing on a high illuminance region where theilluminance is greater than 80 lux (lx), under such high illuminanceconditions, in the dual PD-type pixel and the shield-type pixel, thevalues of the variation (o) for phase difference detection are almostthe same, and almost the same performance can be obtained.

On the other hand, for example, focusing on a low illuminance regionnear 10 lux (lx), under such low illuminance conditions, the value ofthe variation (o) for phase difference detection is larger in theshield-type pixel than in the dual PD-type pixel, and therefore theperformance is low.

As described above, under high illuminance conditions, AF performance(performance of phase difference detection) does not deteriorate evenwith a pixel structure having a low density such as a shield-type pixel.Then, in the present technology, by utilizing the characteristics ofsuch a pixel, under a high illuminance condition, some of the pixels 100arranged in the pixel array unit 11 are configured to independently readat least one electric charge of the electric charge accumulated in thephotodiode 112A or the electric charge accumulated in the photodiode112B.

Therefore, with the configuration of the present technology, even in acase where the dual PD-type pixel is used, the photodiodes 112A and 112Bneed only be read once to obtain the signal for phase differencedetection. Therefore, it is possible to reduce power consumption underhigh illuminance without reducing the distance measurement performance.Furthermore, since it is not necessary to separately read the pixelsignals (A signal and B signal) from the photodiodes 112A and 112B (readtwice), as compared with the case where the reading configurationdisclosed in Patent Document 1 described above is adopted, it ispossible to achieve higher speed.

In other words, with the configuration of the present technology, in thecase of low illuminance, signals for phase difference detection aredetected in all the pixels 100, and in the case of high illuminance,signals for phase difference detection are detected in the discretepixels 100. Therefore, even if the illuminance is low, the distancemeasurement performance can be maintained, and in the case of the highilluminance, the power consumption can be suppressed withoutdeteriorating the distance measurement performance as compared with thecase where the signals for phase difference detection are obtained inall the pixels.

2. Second Embodiment

By the way, since the accuracy of the phase difference detection dependson shot noise, the drive control of the pixel 100 may be linked with notonly the gain, but also the luminance level. Therefore, in the secondembodiment, the driving of the pixels 100 arranged in the pixel arrayunit 11 is controlled on the basis of the gain set in the solid-stateimaging element 10 and the luminance level.

(Configuration Example of the Imaging Apparatus)

FIG. 5 is a block diagram illustrating an example of a configuration ofthe imaging apparatus according to the second embodiment.

In FIG. 5, an imaging apparatus 1A includes the solid-state imagingelement 10 (FIG. 1) and a control unit 200A.

The control unit 200A includes, for example, a control circuit such as amicrocontroller. The control unit 200A includes a drive control unit211, an AE unit 212, and a luminance level detection unit 213.

The AE unit 212 performs processing related to the auto exposure (AE)function on the basis of the output signal output from the solid-stateimaging element 10. For example, the AE unit 212 detects the averageluminance on the basis of the output signal from the solid-state imagingelement 10, and determines the gain according to the detection result.

The AE unit 212 supplies the determined gain to the solid-state imagingelement 10 and the drive control unit 211. Note that this gain is, forexample, for controlling the shutter speed of the solid-state imagingelement 10 and can be said to be exposure information.

The luminance level detection unit 213 detects the luminance level in ascreen on the basis of the output signal output from the solid-stateimaging element 10, and supplies the detection result to the drivecontrol unit 211. Note that the luminance level in the screen is, forexample, the luminance level of a captured image displayed in the screenin a case where the imaging apparatus 1A has a display screen, that is,the luminance level of a target region (local region) in a target imageframe.

The drive control unit 211 is supplied with the gain from the AE unit212 and the luminance level from the luminance level detection unit 213.The drive control unit 211 generates a drive control signal forcontrolling the drive of the pixels 100 arranged in the pixel array unit11 of the solid-state imaging element 10 on the basis of the gain andthe luminance level supplied thereto, and supplies the drive controlsignal to the solid-state imaging element 10.

Here, in the AE unit 212, gain control is performed on the basis of thedetected average luminance (entire luminance), that is, the exposureamount obtained from an image frame preceding the target image frame.For example, in this gain control, the control for increasing the gainis performed in the case of being dark (low illuminance), and thecontrol for reducing the gain is performed in the case of being bright(high illuminance). Therefore, it can be said that the AE unit 212corresponds to an illuminance detection unit that detects theilluminance in the imaging region of the pixel array unit 11 on thebasis of the exposure amount obtained from the previous image frame.Furthermore, the luminance level detection unit 213 obtains theluminance level in a target region (local region).

Then, when the screen (in the target image frame) is captured in a localregion, because there are bright regions and dark regions, the drivecontrol unit 211 can control the drive of the pixels 100 in associationwith not only the illuminance used for gain control, but also theluminance level in the screen. For example, in the screen, a whitesubject has a high luminance level, while a black subject has a lowluminance level, but shot noise increases when the luminance level islow (variation in phase difference detection is large). Therefore, thedrive control unit 211 causes more phase difference detection pixels tobe used.

The solid-state imaging element 10 controls the shutter speed on thebasis of the gain supplied from the AE unit 212 of the control unit200A. Furthermore, the solid-state imaging element 10 drives the pixels100 arranged in the pixel array unit 11 on the basis of the drivecontrol signal supplied from the drive control unit 211 of the controlunit 200A.

(Example of Driving Pixels)

FIG. 6 illustrates an example of pixel drive control according to thesecond embodiment.

For example, the drive control unit 211 calculates the following formula(1) on the basis of the gain and the luminance level supplied thereto,and performs a threshold value determination on the calculation result.Then, the drive control unit 211 controls the drive of the pixels 100arranged in the pixel array unit 11 of the solid-state imaging element10 on the basis of the determination result.

Gain+1/Luminance level  (1)

Here, in Formula (1), the “Gain” of the first term becomes a smallervalue as the illuminance in the imaging region of the pixel array unit11 becomes larger, and the value of the calculation result also becomessmaller, and the gain becomes a larger value as the illuminance in theimaging region becomes smaller, and the value of the calculation resultalso becomes larger. Furthermore, in Formula (1), the second term isexpressed by “+1/Luminance level”. Therefore, the value of thecalculation result becomes larger as the luminance level in the targetregion (local region) in the screen (in the target image frame) islower.

For example, in a case where the calculation result of Formula (1) issmaller than the first threshold value Th1, the drive control unit 211follows the drive control A to control the drive of the pixels 100 suchthat, among all the pixels arranged in the pixel array unit 11, 3% ofthe pixels 100 operate as phase difference detection pixels and theremaining 97% of the pixels 100 operate as image acquisition pixels.

At this time, in the solid-state imaging element 10, in the pixels 100(3% of the pixels) that operate as phase difference detection pixels,the electric charges accumulated in one of the photodiode 112A of theleft pixel 100A and the photodiode 112B of the right pixel 100B are readindependently.

Furthermore, for example, when the calculation result of Formula (1) islarger than the first threshold value Th1 and smaller than the secondthreshold value Th2, the drive control unit 211 follows the drivecontrol B to control the drive of the pixels 100 such that, among allthe pixels arranged in the pixel array unit 11, 6% of the pixels 100operate as phase difference detection pixels and the remaining 94% ofthe pixels 100 operate as image acquisition pixels.

At this time, in the solid-state imaging element 10, in the pixels 100(6% of the pixels) that operate as phase difference detection pixels,the electric charges accumulated in one of the photodiode 112A of theleft pixel 100A and the photodiode 112B of the right pixel 100B are readindependently.

Moreover, for example, in a case where the calculation result of Formula(1) is larger than the second threshold value Th2, the drive controlunit 211 follows the drive control C to control the drive of the pixels100 such that all the pixels (100% of the pixels) arranged in the pixelarray unit 11 operate as both pixels: phase difference detection pixelsand image acquisition pixels.

At this time, in the solid-state imaging element 10, in all the pixels(100% of the pixels), the electric charges accumulated in the photodiode112A of the left pixel 100A and the photodiode 112B of the right pixel100B are read.

As described above, in the second embodiment, threshold valuedetermination with respect to the calculation result of Formula (1)using the gain and the luminance level is performed, and on the basis ofresults of the determination, among the pixels 100 arranged in the pixelarray unit 11, in a predetermined density (for example, 3%, 6%, or thelike) of the pixels 100, one of the photodiode 112A and the photodiode112B is set to an independently read target.

That is, in a case where the dual PD-type pixels 100 are arranged in thepixel array unit 11, in a case where the calculation result of Formula(1) is larger than a predetermined threshold value (for example, thesecond threshold value Th2), all the pixels 100 operate as phasedifference detection pixels, but in a case where the calculation resultof Formula (1) is smaller than a predetermined threshold value (forexample, the first threshold value Th1 or the second threshold valueTh2), only the specific pixels 100 arranged in a scattered manner (in arepeating pattern) operate as phase difference detection pixels.

When such driving is performed, in a case where the accuracy of phasedifference detection is low, for example, at the time of low illuminanceor due to low luminance level of the target region, signals for phasedifference detection are detected in more number of pixels 100, and, ina case where the accuracy of phase difference detection is high, forexample, at the time of high illuminance or due to high luminance levelof the target region, signals for phase difference detection aredetected in the discrete pixels 100. Therefore, it is possible toachieve lower power consumption at high illuminance and high speedwithout reducing the distance measurement performance.

Note that, also in FIG. 6, the number of threshold values used in thethreshold value determination is arbitrary, and furthermore a hysteresismay be provided for the threshold value. Furthermore, the above Formula(1) is an example of an arithmetic expression using the gain and theluminance level, and another arithmetic expression to which a functionsuch as logarithm is applied may be used, for example. Furthermore, inthe imaging apparatus 1A of the second embodiment illustrated in FIG. 5,the configuration excluding the luminance level detection unit 213corresponds to the configuration described in the first embodimentdescribed above, that is, the configuration for controlling the drive ofthe pixels 100 arranged in the pixel array unit 11 on the basis ofresults of the threshold value determination using the gain.

Furthermore, in FIG. 6, similarly to FIG. 3 described above, forexample, in the drive control B, in a case where the density of thepixels 100 used as the phase difference detection pixels is 6%, thephotodiode 112A and the photodiode 112B are independently read so thatpixel signals (A signal and B signal) can be obtained and used assignals for phase difference detection.

3. Third Embodiment

Furthermore, as described above, since the accuracy of the phasedifference detection depends on shot noise, the drive control of thepixel 100 may be linked with the number of pixels 100 that have operatedas phase difference detection pixels in addition to the gain and theluminance level. Therefore, in the third embodiment, the driving of thepixels 100 arranged in the pixel array unit 11 is controlled on thebasis of the gain set in the solid-state imaging element 10, theluminance level, and the number of phase difference detection pixels.

(Configuration Example of the Imaging Apparatus)

FIG. 7 is a block diagram illustrating an example of a configuration ofthe imaging apparatus according to the third embodiment.

In FIG. 7, an imaging apparatus 1B includes the solid-state imagingelement 10 (FIG. 1) and a control unit 200B.

In comparison to the control unit 200A (FIG. 5), the control unit 200Bfurther includes a phase difference detection unit 214 and a countingunit 215 in addition to the drive control unit 211, the AE unit 212, andthe luminance level detection unit 213.

The phase difference detection unit 214 detects the phase difference onthe basis of the output signal (signal for phase difference detection)output from the solid-state imaging element 10, and outputs thedetection result to a circuit (not illustrated) in a subsequent stage.Furthermore, the phase difference detection unit 214 supplies theinformation associated with the effective phase difference detectionpixel obtained at the time of the phase difference detection(hereinafter, referred to as effective phase difference pixelinformation) to the counting unit 215.

The counting unit 215, on the basis of the effective phase differencepixel information supplied from the phase difference detection unit 214,among the pixels 100 that have operated as the phase differencedetection pixels, counts the number of effective phase differencedetection pixels, and supplies the count result (the number of effectivephase difference detection pixels) to the drive control unit 211.

The drive control unit 211 is supplied with the count result from thecounting unit 215 in addition to the gain from the AE unit 212 and theluminance level from the luminance level detection unit 213. The drivecontrol unit 211 generates a drive control signal for controlling thedrive of the pixels 100 on the basis of the gain, the luminance level,and the number of effective phase difference detection pixels suppliedthereto, and supplies the drive control signal to the solid-stateimaging element 10.

Here, since the phase difference detection unit 214 cannot effectivelydetect the phase difference unless, for example, the edge of a subjectimage can be discriminated, the counting unit 215 counts the number ofphase difference detection pixels used for effective phase differencedetection on the basis of the effective phase difference pixelinformation.

Then, the drive control unit 211 can control the drive of the pixels 100in association with not only the illuminance used for gain control andthe luminance level in the screen, but also the number of effectivephase difference detection pixels. For example, when the number ofeffective phase difference detection pixels is small, the variation inphase difference detection increases, and therefore the drive controlunit 211 uses more phase difference detection pixels.

(Example of Driving Pixels)

FIG. 8 illustrates an example of pixel drive control according to thethird embodiment.

For example, the drive control unit 211 calculates the following formula(2) on the basis of the gain, the luminance level, and the number ofeffective phase difference detection pixels supplied thereto, andperforms a threshold value determination on the calculation result.Then, the drive control unit 211 controls the drive of the pixels 100arranged in the pixel array unit 11 of the solid-state imaging element10 on the basis of the determination result.

Gain+1/Luminance level+1/Number of effective phase difference detectionpixels  (2)

Here, in Formula (2), the first term and the second term are similar toFormula (1) described above, and the third term is represented by“1/Number of effective phase difference detection pixels”, and thereforethe smaller the number of effective phase difference detection pixels,the larger the value of the calculation result.

For example, in a case where the calculation result of Formula (2) issmaller than the first threshold value Th1, the drive control unit 211follows the drive control A to control the drive of the pixels 100 suchthat, among all the pixels arranged in the pixel array unit 11, 3% ofthe pixels 100 operate as phase difference detection pixels.

Furthermore, for example, in a case where the calculation result ofFormula (2) is larger than the first threshold value Th1 and smallerthan the second threshold value Th2, the drive control unit 211 followsthe drive control B to control the drive of the pixels 100 such that,among all the pixels arranged in the pixel array unit 11, 6% of thepixels 100 operate as phase difference detection pixels.

Moreover, for example, in a case where the calculation result of Formula(2) is larger than the second threshold value Th2, the drive controlunit 211 follows the drive control C to control the drive of the pixels100 such that all the pixels (100% of the pixels) arranged in the pixelarray unit 11 operate as both pixels: phase difference detection pixelsand image acquisition pixels.

As described above, in the third embodiment, threshold valuedetermination with respect to the calculation result of Formula (2)using the gain, the luminance level, and the number of effective phasedifference detection pixels is performed, and on the basis of results ofthe determination, among the pixels 100 arranged in the pixel array unit11, in a predetermined density (for example, 3%, 6%, or the like) of thepixels 100, one of the photodiode 112A and the photodiode 112B is set toan independently read target.

That is, in a case where the dual PD-type pixels 100 are arranged in thepixel array unit 11, in a case where the calculation result of Formula(2) is larger than a predetermined threshold value (for example, thesecond threshold value Th2), all the pixels 100 operate as phasedifference detection pixels, but in a case where the calculation resultof Formula (2) is smaller than a predetermined threshold value (forexample, the first threshold value Th1 or the second threshold valueTh2), only the specific pixels 100 arranged in a scattered manner (in arepeating pattern) operate as phase difference detection pixels.

When such driving is performed, in a case where the accuracy of phasedifference detection is low, for example, due to a small number ofeffective phase difference detection pixels, signals for phasedifference detection are detected in more number of pixels 100, and, ina case where the accuracy of phase difference detection is high, forexample, due to a large number of effective phase difference detectionpixels, signals for phase difference detection are detected in thediscrete pixels 100. Therefore, it is possible to achieve lower powerconsumption at high illuminance and high speed without reducing thedistance measurement performance.

Note that, also in FIG. 8, the number of threshold values used in thethreshold value determination is arbitrary, and furthermore a hysteresiscan be provided for the threshold value. Furthermore, the above Formula(2) is an example of an arithmetic expression using the gain, theluminance level, and the number of phase difference detection pixels,and another arithmetic expression to which a function such as logarithmis applied may be used, for example. Moreover, in the above Formula (2),it is described that the calculation using the gain, the luminancelevel, and the number of phase difference detection pixels is performed,but calculation using at least one calculation target among thesecalculation targets may be performed.

Furthermore, in FIG. 8, similarly to FIG. 3 described above, forexample, in the drive control B, in a case where the density of thepixels 100 used as the phase difference detection pixels is 6%, thephotodiode 112A and the photodiode 112B are independently read so thatpixel signals (A signal and B signal) can be obtained and used assignals for phase difference detection.

4. Fourth Embodiment

Furthermore, as described above, since the accuracy of the phasedifference detection depends on shot noise, the drive control of thepixel 100 may be linked with (the number of pixels included in) a ROIarea corresponding to the AF area corresponding to the phase differencedetection pixels in addition to the gain and the luminance level.Therefore, in the fourth embodiment, the driving of the pixels 100arranged in the pixel array unit 11 is controlled on the basis of thegain set in the solid-state imaging element 10, the luminance level, andthe ROI area.

(Configuration Example of the Imaging Apparatus)

FIG. 9 is a block diagram illustrating an example of a configuration ofthe imaging apparatus according to the fourth embodiment.

In FIG. 9, an imaging apparatus 1C includes the solid-state imagingelement 10 (FIG. 1) and a control unit 200C.

In comparison to the control unit 200A (FIG. 5), the control unit 200Cfurther includes a ROI setting unit 216 in addition to the drive controlunit 211, the AE unit 212, and the luminance level detection unit 213.

The ROI setting unit 216 sets a region of interest (ROI). The ROIsetting unit 216 acquires information associated with the ROI area(hereinafter referred to as ROI area information) on the basis of thesetting information of the ROI, and supplies it to the drive controlunit 211. Note that the ROI area is the size of a region of interest(ROI) in the target image frame.

The drive control unit 211 is supplied with the ROI area informationfrom the ROI setting unit 216 in addition to the gain from the AE unit212 and the luminance level from the luminance level detection unit 213.The drive control unit 211 generates a drive control signal forcontrolling the drive of the pixels 100 on the basis of the gain, theluminance level, and the ROI area information supplied thereto, andsupplies the drive control signal to the solid-state imaging element 10.

Here, for example, in a case where the imaging apparatus 1C has afunction (touch AF function) for a user to touch a screen with a fingerto select a subject to be focused, the ROI setting unit 216 acquires theROI area corresponding to the area of the AF area for the subjectselected by the user.

Then, the drive control unit 211 can control the drive of the pixels 100in association with not only the illuminance used for gain control andthe luminance level in the screen, but also the ROI area. For example,when the ROI area is small, the variation in phase difference detectionincreases, and therefore the drive control unit 211 uses more phasedifference detection pixels.

(Example of Driving Pixels)

FIG. 10 illustrates an example of pixel drive control according to thefourth embodiment.

For example, the drive control unit 211 calculates the following formula(3) on the basis of the gain, the luminance level, and the ROI areainformation supplied thereto, and performs a threshold valuedetermination on the calculation result. Then, the drive control unit211 controls the drive of the pixels 100 arranged in the pixel arrayunit 11 of the solid-state imaging element 10 on the basis of thedetermination result.

Gain+1/Luminance level+1/ROI area  (3)

Here, in Formula (3), the first term and the second term are similar toFormula (1) described above, and the third term is represented by “1/ROIarea”, and therefore the smaller the (size of) the ROI area, the largerthe value of the calculation result.

For example, in a case where the calculation result of Formula (3) issmaller than the first threshold value Th1, the drive control unit 211follows the drive control A to control the drive of the pixels 100 suchthat, among all the pixels arranged in the pixel array unit 11, 3% ofthe pixels 100 operate as phase difference detection pixels.

Furthermore, for example, in a case where the calculation result ofFormula (3) is larger than the first threshold value Th1 and smallerthan the second threshold value Th2, the drive control unit 211 followsthe drive control B to control the drive of the pixels 100 such that,among all the pixels arranged in the pixel array unit 11, 6% of thepixels 100 operate as phase difference detection pixels.

Moreover, for example, in a case where the calculation result of Formula(3) is larger than the second threshold value Th2, the drive controlunit 211 follows the drive control C to control the drive of the pixels100 such that all the pixels (100% of the pixels) arranged in the pixelarray unit 11 operate as both pixels: phase difference detection pixelsand image acquisition pixels.

As described above, in the fourth embodiment, threshold valuedetermination with respect to the calculation result of Formula (3)using the gain, the luminance level, and the ROI area is performed, andon the basis of results of the determination, among the pixels 100arranged in the pixel array unit 11, in a predetermined density (forexample, 3%, 6%, or the like) of the pixels 100, one of the photodiode112A and the photodiode 112B is set to an independently read target.

That is, in a case where the dual PD-type pixels 100 are arranged in thepixel array unit 11, in a case where the calculation result of Formula(3) is larger than a predetermined threshold value (for example, thesecond threshold value Th2), all the pixels 100 operate as phasedifference detection pixels, but in a case where the calculation resultof Formula (3) is smaller than a predetermined threshold value (forexample, the first threshold value Th1 or the second threshold valueTh2), only the specific pixels 100 arranged in a scattered manner (in arepeating pattern) operate as phase difference detection pixels.

When such driving is performed, in a case where the accuracy of phasedifference detection is low, for example, due to a small ROI area,signals for phase difference detection are detected in more number ofpixels 100, and, in a case where the accuracy of phase differencedetection is high, for example, due to a large ROI area, signals forphase difference detection are detected in the discrete pixels 100.Therefore, it is possible to achieve lower power consumption at highilluminance and high speed without reducing the distance measurementperformance.

Furthermore, by using the ROI area for the threshold valuedetermination, for example, it becomes possible to control the driveaccording to the illuminance of the region to be focused on within theentire screen, and therefore distance measurement performance can befurther increased.

Note that, also in FIG. 10, the number of threshold values used in thethreshold value determination is arbitrary, and furthermore a hysteresiscan be provided for the threshold value. Furthermore, the above Formula(3) is an example of an arithmetic expression using the gain, theluminance level, and the ROI area, and another arithmetic expression towhich a function such as logarithm is applied may be used, for example.

Moreover, in the above Formula (3), it is described that the calculationusing the luminance level, the gain, and the ROI area is performed, butcalculation using at least one calculation target among thesecalculation targets may be performed. Furthermore, the number ofeffective phase difference detection pixels may be used together withthe ROI area in addition to the gain and the luminance level bycombining Formulae (2) and (3).

Furthermore, in FIG. 10, similarly to FIG. 3 described above, forexample, in the drive control B, in a case where the density of thepixels 100 used as the phase difference detection pixels is 6%, thephotodiode 112A and the photodiode 112B are independently read so thatpixel signals (A signal and B signal) can be obtained and used assignals for phase difference detection.

5. Fifth Embodiment

By the way, in a case where the drive control of the pixels 100 isperformed on the basis of the drive control A and the drive control Bdescribed above, and partially, the photodiode 112A of the left pixel100A or the photodiode 112B of the right pixel 100B is independentlyread, the pixel signals independently read from one of the photodiode112A and the photodiode 112B cannot be used as they are for a capturedimage, and thus correction is needed. Therefore, in the fifthembodiment, a configuration of the case where correction processing isperformed on an output signal output from the solid-state imagingelement 10 will be described.

(Configuration Example of the Imaging Apparatus)

FIG. 11 is a block diagram illustrating an example of a configuration ofthe imaging apparatus according to the fifth embodiment.

In FIG. 11, an imaging apparatus 1A includes the solid-state imagingelement 10 (FIG. 1), the control unit 200A (FIG. 5), and a signalprocessing unit 300. In comparison to the configuration illustrated inFIG. 5, the imaging apparatus 1A of FIG. 11 further includes the signalprocessing unit 300 in addition to the solid-state imaging element 10and the control unit 200A.

The signal processing unit 300 includes a pixel correction unit 311, aselector 312, and an image signal processing unit 313. The output signal(pixel signal) output from the solid-state imaging element 10 issupplied to each of the pixel correction unit 311 and the selector 312.

The pixel correction unit 311 performs pixel correction processing onthe pixel signal from the solid-state imaging element 10, and suppliesthe resultant corrected pixel signal (corrected pixel signal) to theselector 312.

For example, in this pixel correction processing, in a case where thepixel signal (A signal) from the photodiode 112A of the left pixel 100Aconstituting the pixel 100 as the phase difference detection pixel issupplied, the correction processing for obtaining a signal correspondingto the pixel signal (B signal) from the photodiode 112B of thecorresponding right pixel 100B is performed, and a pixel signal that canbe used for a captured image is obtained.

To the selector 312, the pixel signal output from the solid-stateimaging element 10 and the corrected pixel signal supplied from thepixel correction unit 311 are input as input signals, and the drivecontrol signal output from the drive control unit 211 of the controlunit 200A is input as a selection control signal.

The selector 312 selects one of the pixel signals from the pixel signalfrom the solid-state imaging element 10 and the corrected pixel signalfrom the pixel correction unit 311 on the basis of the drive controlsignal from the drive control unit 211, and supplies the pixel signal tothe image signal processing unit 313.

Here, the drive control signal is based on the drive control method(drive control A, B, C) determined by the threshold value determinationon the calculation result of Formula (1), and the position and densityof the phase difference detection pixels are linked with the gain(illuminance) and the luminance level. Therefore, by inputting the drivecontrol signal as the selection control signal of the selector 312, theposition and density of the phase difference detection pixel can belinked with the pixel signal that needs to be corrected by the pixelcorrection unit 311.

For example, in a case where the pixels 100 arranged in the pixel arrayunit 11 are driven according to the drive control A (FIG. 6) determinedby the threshold value determination with respect to the calculationresult of the Formula (1), a pixel signal (A signal or B signal)independently read from one of the photodiode 112A and the photodiode112B of the pixels 100 (3% of the pixels) that operate as the phasedifference detection pixel is input to and corrected by the pixelcorrection unit 311. On the other hand, the pixel signal (A+B signal)read from both the photodiode 112A and the photodiode 112B of the pixels100 (97% of the pixels) that operate as the image acquisition pixelsdoes not need to be corrected and is input to the selector 312 as it is.

Furthermore, for example, in a case where the pixels 100 arranged in thepixel array unit 11 are driven according to the drive control C (FIG.6), the pixel signal (A+B signal) read from the photodiode 112A and thephotodiode 112B of the pixels 100 (100% of the pixels) that operate asboth pixels: the phase difference detection pixel and the imageacquisition pixel does not need to be corrected and is input to theselector 312 as it is.

The image signal processing unit 313 performs predetermined image signalprocessing on the basis of the pixel signal supplied from the selector312, and outputs the resultant pixel signal to the circuit at asubsequent stage. As the image signal processing here, for example,signal processing such as demosaic, noise removal, gradation correction,color correction, image compression/expansion, and the like isperformed. Furthermore, although illustration is omitted, the signal forphase difference detection is output to the phase difference detectionunit and used in the processing for detecting the phase differencethere.

Note that, in FIG. 11, the case where the imaging apparatus 1A includesthe solid-state imaging element 10 (FIG. 1), the control unit 200A (FIG.5), and the image signal processing unit 300 has been described, but inthe imaging apparatus 1A, instead of the control unit 200A, the controlunit 200B (FIG. 7) or the control unit 200C (FIG. 9) may be included.

6. Sixth Embodiment

Next, the read function of the pixels 100 arranged in the pixel arrayunit 11 will be described.

Note that, here, the configuration of the read function of the presenttechnology is illustrated in FIGS. 14 and 15, and the configuration ofthe current read function is illustrated in FIGS. 12 and 13, anddescription will be made by comparing the read function of the presenttechnology with the current read function.

(Configuration of the Read Function)

FIGS. 12 to 15 illustrate a partial region of the imaging region in thepixel array unit 11, comparators 151 and a DAC 152 in the column signalprocessing circuit 13.

In FIGS. 12 to 15, it is assumed that the circles described on thephotodiodes 112A and 112B constituting the pixels 100 represent contactsC, and the rhombuses described every four pixels in the column directionrepresent floating diffusion regions FD.

In the pixel array unit 11, the plurality of pixels 100 arrangedtwo-dimensionally is arranged in a Bayer arrangement. In the pixel arrayunit 11, the pixels 100 arranged in the column direction share thefloating diffusion region FD. Furthermore, the drive signals (TRG, SEL)with respect to a transfer transistor TR-Tr or a selection transistorSEL-Tr are supplied from the vertical drive circuit 12 (FIG. 1).

Each pixel 100 includes the left pixel 100A and the right pixel 100B.The left pixel 100A has a transfer transistor TR-Tr-A in addition to thephotodiode 112A. Furthermore, the right pixel 100B has a transfertransistor TR-Tr-B in addition to the photodiode 112B.

In each pixel 100, the transfer transistors TR-Tr-A and TR-Tr-Bconnected to the photodiodes 112A and 112B perform an on/off operationaccording to the drive signal TRG input to their gates such thatelectric charges (signal charges) photoelectrically converted by thephotodiodes 112A and 112B are transferred to the floating diffusionregion FD.

The floating diffusion region FD is formed at a connection point betweenthe transfer transistors TR-Tr-A and TR-Tr-B of the pixels 100, whichare the share pixels, and a reset transistor RST-Tr and an amplificationtransistor AMP-Tr shared by the share pixels. The reset transistorRST-Tr performs an on/off operation according to the drive signal RSTinput to its gate such that the electric charge accumulated in thefloating diffusion region FD is discharged.

The floating diffusion region FD has a function of accumulating theelectric charge transferred by the transfer transistors TR-Tr-A andTR-Tr-B of the pixels 100, which are the share pixels. The potential ofthe floating diffusion region FD is modulated according to theaccumulated electric charge amount. The amplification transistor AMP-Troperates as an amplifier that turns the potential variation of thefloating diffusion region FD connected to its gate as an input signal,and the output signal voltage is output to the vertical signal line(VSL) 22 via the selection transistor SEL-Tr.

The selection transistor SEL-Tr performs an on/off operation accordingto the drive signal SEL input to its gate and outputs a voltage signalfrom the amplification transistor AMP-Tr to the vertical signal line(VSL) 22.

In this way, the pixels 100 arranged in the pixel array unit 11 areshare pixels in the column direction, and the left pixel 100A of eachpixel 100 of the share pixels has the photodiode 112A and the transfertransistor TR-Tr-A, and the right pixel 100B has the photodiode 112B andthe transfer transistor TR-Tr-B. Furthermore, in the share pixels, thefloating diffusion region FD is shared, and as the pixel circuit of theshare pixel, the reset transistor RST-Tr, the amplification transistorAMP-Tr, and the selection transistor SEL-Tr are shared as the sharedtransistors.

The signal voltage output to the vertical signal line (VSL) 22 is inputto the comparators 151 in the column signal processing circuit 13.

A comparator 151-1 compares a signal voltage (Vx) from a vertical signalline (VSL1) 22-1 with a reference voltage (Vref) of the ramp wave (ramp)from the DAC 152, and outputs an output signal of a level according tothe comparison result.

Similarly, comparators 151-2 to 151-4 are similar to the comparator151-1 except that the signal voltage to be compared with the referencevoltage is changed to be a signal voltage from a vertical signal line(VSL3) 22-3, a vertical signal line (VSL5) 22-5, or a vertical signalline (VSL7) 22-7, and an output signal of a level according to thecomparison result is output.

Then, in the column signal processing circuit 13, the reset level or thesignal level is counted on the basis of the output signal from thecomparator 151, thereby achieving AD conversion of the column AD methodusing correlated double sampling (CDS).

(Contact Arrangement: Current Configuration)

Here, regarding the arrangement of the contacts C of the pixel 100, thearrangement is partially different between the configuration of thecurrent read function illustrated in FIGS. 12 and 13 and theconfiguration of the read function of the present technology illustratedin FIGS. 14 and 15. Note that, in the following description, thearrangement position of the pixels 100 of each row and the pixels 100 ofeach column will be described with reference to the upper left pixel100. Furthermore, in the following description, “SEL” and “TRG” in thedrawings are used to distinguish drive lines and drive signals appliedto the corresponding drive lines.

That is, in the current configuration (FIGS. 12 and 13), in the pixels100 of the first row, the contacts C for the transfer transistorsTR-Tr-A and TR-Tr-B connected to the photodiodes 112A and 112B areconnected to drive lines TRG6 and TRG7, respectively. Furthermore, inthe pixels 100 of the second row, the contacts C for the transfertransistors TR-Tr-A and TR-Tr-B connected to the photodiodes 112A and112B are connected to drive lines TRG4 and TRG5, respectively.

Furthermore, in the current configuration (FIGS. 12 and 13), in thepixels 100 of the third row, the contacts C for the transfer transistorsTR-Tr-A and TR-Tr-B are connected to drive lines TRG2 and TRG3,respectively, and in the pixels 100 of the fourth row, the contacts Cfor the transfer transistors TR-Tr-A and TR-Tr-B are connected to drivelines TRG0 and TRG1, respectively.

Similarly, in the current configuration (FIGS. 12 and 13), in the pixels100 of the fifth to eighth rows, the contacts C for the transfertransistor TR-Tr-A are connected to the drive line TRG0, TRG2, TRG4, orTRG6, and the contacts C for the transfer transistor TR-Tr-B areconnected to the drive line TRG1, TRG3, TRG5, or TRG7.

(Contact Arrangement: Configuration of the Present Technology)

On the other hand, in the configuration of the present technology (FIGS.14 and 15), the pixels 100 of the first to fifth rows and the seventh toeighth rows are similar to the configuration indicated by the currentconfiguration (FIGS. 12 and 13) such that the contacts C for thetransfer transistor TR-Tr-A are connected to the drive line TRG0, TRG2,TRG4, or TRG6, and the contacts C for the transfer transistor TR-Tr-Bare connected to the drive line TRG1, TRG3, TRG5, or TRG7.

Here, in the configuration of the present technology (FIGS. 14 and 15),focusing on the pixels 100 of the sixth row, a drive line TRG10 is addedbetween the drive line TRG4 and the drive line TRG5.

Then, among the pixels 100 of the sixth row, the pixels 100 of the firstcolumn, the third column, and the fourth column are similar to theconfiguration indicated by the current configuration (FIGS. 12 and 13)such that the contacts C for transfer transistor TR-Tr-A are connectedto the drive line TRG4, and the contacts C for the transfer transistorTR-Tr-B are connected to the drive line TRG5.

Furthermore, in the pixels 100 of the sixth row, a pixel 100-62 of thesecond column is such that a contact C-62A for the left transfertransistor TR-Tr-A is connected to the drive line TRG4, but a contactC-62B for the right transfer transistor TR-Tr-B is connected to theadded drive line TRG10.

That is, in a case where attention is paid to the pixel 100-62, in theconfiguration indicated by the configuration (FIGS. 14 and 15) of thepresent technology, as compared with the configuration indicated by thecurrent configuration (FIGS. 12 and 13), the configurations areidentical in that the contact C-62A is connected to the drive line TRG4,but are different in that the contact C-62B is connected to the driveline TRG10, not the drive line TRG5.

In other words, it can be said that the pixel array unit 11 includes afirst drive line (e.g., drive line TRG4) connected to a firstphotoelectric conversion unit (e.g., photodiode 112A) of a first pixelportion (e.g., the pixel 100 of the sixth row (excluding the pixel100-62 of the second column)) and the second pixel portion (e.g., thepixel 100-62 of the second column), a second drive line (e.g., driveline TRG5) connected to a second photoelectric conversion unit (e.g.,photodiode 112B) of the first pixel portion (e.g., the pixel 100 of thesixth row (excluding the pixel 100-62 of the second column)), and athird drive line (e.g., drive line TRG10) connected to the secondphotoelectric conversion unit (e.g., photodiode 112B) of the secondpixel portion (e.g., the pixel 100-62 of the second column).

At this time, the second drive line (e.g., drive line TRG5) isnonconnected to the second photoelectric conversion unit (e.g.,photodiode 112B) of the second pixel portion (e.g., the pixel 100-62 ofthe second column). Furthermore, the third drive line (e.g., drive lineTRG10) is nonconnected to the second photoelectric conversion unit(e.g., the photodiode 112B) of the first pixel portion (e.g., the pixel100 of the sixth row (excluding the pixel 100-62 of the second column)).

(Read Operation: Current Configuration)

Next, a read operation in the case of having the above-describedconfiguration will be described. Here, first of all, the current readoperation will be described with reference to FIGS. 12 and 13.

In FIG. 12, the drive signal SEL1 becomes an L level, and the selectiontransistor SEL-Tr shared by the share pixels including the pixels 100 ofthe first to fourth rows on the upper side is in an OFF state, while thedrive signal SEL0 becomes an H level, and the selection transistorSEL-Tr shared by the share pixels including the pixels 100 of the fifthto eighth rows on the lower side is in an ON state. Therefore, the sharepixel including the pixels 100 of the fifth to eighth rows on the lowerside is selected.

At this time, as illustrated in FIG. 12, among the drive signals TRG0 toTRG7, only the drive signal TRG4 becomes an H level, and in each pixel100 of the sixth row, the transfer transistor TR-Tr-A connected to thephotodiode 112A is in an ON state.

Therefore, the electric charge accumulated in the photodiode 112A ofeach pixel 100 of the sixth row, which is surrounded by the thick framein FIG. 12, is transferred to the floating diffusion region FDcorresponding to each share pixel. Then, in the share pixel includingeach pixel 100 of the sixth row, in the amplification transistor AMP-Tr,the potential variation of the floating diffusion region FD is used asan input signal voltage to the gate, and the output signal voltage isoutput to the vertical signal line 22 via the selection transistorSEL-Tr.

In this way, the electric charge accumulated in the photodiode 112A ofeach pixel 100 of the sixth row is independently read, and the pixelsignal (A signal) is obtained.

Thereafter, as illustrated in FIG. 13, while the drive signal SEL0remains at an H level, the drive signals TRG4 and TRG5 become an Hlevel, and in each pixel 100 of the sixth row, the transfer transistorTR-Tr-A connected to the photodiode 112A and the transfer transistorTR-Tr-B connected to the photodiode 112B simultaneously become an ONstate.

Therefore, the electric charges accumulated in both the photodiodes 112Aand 112B of each pixel 100 of the sixth row, which are surrounded by thethick frame in FIG. 13, are transferred to the floating diffusion regionFD. Then, in the share pixel including each pixel 100 of the sixth row,by the amplification transistor AMP-Tr, the signal voltage depending onthe potential variation of the floating diffusion region FD is output tothe vertical signal line 22 via the selection transistor SEL-Tr.

In this way, the electric charges accumulated in the photodiodes 112Aand 112B of each pixel 100 of the sixth row are added up and read, andthe pixel signal (A+B signal) is obtained.

Then, in the current read operation, as illustrated in FIGS. 12 and 13,the A signal is obtained as a signal for phase difference detection, andthe A+B signal is obtained as a signal for image acquisition. Therefore,by performing the difference processing between the A+B signal and the Asignal, a signal corresponding to the B signal can be acquired.Therefore, the A signal and the B signal are obtained as signals forphase difference detection. That is, the current read operation requirestwo read operations in order to acquire the signal for phase differencedetection.

(Read Operation: Configuration of the Present Technology)

Next, the read operation of the present technology will be describedwith reference to FIGS. 14 and 15.

In FIG. 14, the drive signal SEL0 becomes an H level, and the selectiontransistor SEL-Tr shared by the share pixels including the pixels 100 ofthe fifth to eighth rows on the lower side is in the ON state.Therefore, the share pixel including the pixels 100 of the fifth toeighth rows on the lower side is selected.

At this time, as illustrated in FIG. 14, among the drive signals TRG0 toTRG7 and TRG10, the drive signals TRG4 and TRG5 become an H level, andthe transfer transistor TR-Tr-A connected to the photodiode 112A and thetransfer transistor TR-Tr-B connected to the photodiode 112B of eachpixel 100 of the sixth row (excluding the pixels 100 of the secondcolumn) simultaneously become an ON state.

Therefore, in each pixel 100 of the sixth row (excluding the pixels 100of the second column), as indicated by the thick frames in FIG. 14, theelectric charges accumulated in the photodiodes 112A and 112B are addedup and read, and the pixel signal (A+B signal) is obtained.

Here, among the pixels 100 of the sixth row, focusing on the pixel100-62 of the second column, as described above, a contact C-62Bconnected to the photodiode 112B is connected to the drive line TRG10,and since the drive signal TRG10 applied thereto is at an L level, onlythe left transfer transistor TR-Tr-A becomes an ON state.

Therefore, in the pixel 100-62, as indicated by the thick frame in FIG.14, the electric charge accumulated in the left photodiode 112A isindependently read, and the pixel signal (A signal) is obtained.

Furthermore, although illustration is omitted, the pixels 100 arrangedin the pixel array unit 11 include pixels 100 in which the electriccharge accumulated in the right photodiode 112B is independently readand the pixel signal (B signal) can be acquired in contrast to the pixel100-62. For example, if the pixel 100-62 described above is the pixel100 capable of acquiring the B signal, it is only required to connectthe contact C-62A to the drive line TRG10 instead of the drive lineTRG4, and connect the contact C-62B to the drive line TRG5.

That is, the pixels 100 arranged in the pixel array unit 11 includepixels 100 capable of acquiring the A+B signal as the image acquisitionpixel, and pixels 100 capable of acquiring the A signal and pixels 100capable of acquiring the B signal as the phase difference detectionpixel. Here, as indicated in the above-described first to fourthembodiments, the density of the pixels 100 operating as the phasedifference detection pixels is determined on the basis of the gain, theluminance level, and the like (for example, 3% or the like in the caseof the drive control A), and the pixel 100 according to the densityoperates as the phase difference detection pixel for obtaining the Asignal or the B signal.

Then, in the read operation of the present technology, as illustrated inFIG. 14, the A signal and the B signal are obtained as signals for phasedifference detection, and the A+B signal is obtained as a signal forimage acquisition. Therefore, in order to acquire a signal for phasedifference detection, it is only necessary to perform the read operationonce. That is, in the above-described current read operation, it wasnecessary to perform reading twice in order to acquire the signal forphase difference detection, but in the read operation of the presenttechnology, it is possible to reduce the number of times of readoperation to one.

Note that in a case where the pixel 100-62 is caused to operate as theimage acquisition pixel, as illustrated in FIG. 15, the drive signalSEL0 is set to an H level state, and moreover the drive signals TRG4 andTRG5 and the drive signal TRG10 are set to an H level. Therefore, in thepixel 100-62, similarly to each of the other pixels 100 of the sixthrow, the transfer transistors TR-Tr-A and TR-Tr-B are simultaneously setto an ON state, and as indicated by the thick frame in FIG. 15, theelectric charges accumulated in the photodiodes 112A and 112B are addedup and read, and the pixel signal (A+B signal) is obtained.

In other words, in the read operation of the present technology, it canbe said that, in a case where the illuminance in the imaging region ofthe pixel array unit 11 (or, for example, the calculation result ofFormula (1), (2), or (3)) is smaller than a predetermined thresholdvalue (e.g., the first threshold value Th1 or the second threshold valueTh2), in the first pixel portion (e.g., the pixel 100 of the sixth row(excluding the pixel 100-62 of the second column)), a pixel signalcorresponding to the first photoelectric conversion unit (e.g., thephotodiode 112A) and a pixel signal corresponding to the secondphotoelectric conversion unit (e.g., the photodiode 112B) are generatedusing the first drive line (e.g., the drive line TRG4) and the seconddrive line (e.g., the drive line TRG5), in a case where the illuminanceis larger than the predetermined threshold value, in the second pixelportion (e.g., the pixel 100-62 of the second column), a pixel signalcorresponding to the first photoelectric conversion unit (e.g., thephotodiode 112A) and a pixel signal corresponding to the secondphotoelectric conversion unit (e.g., the photodiode 112B) are generatedusing the first drive line (e.g., the drive line TRG4) and the thirddrive line (e.g., the drive line TRG10), and meanwhile in the firstpixel portion (e.g., the pixel 100 of the sixth row (excluding the pixel100-62 of the second column)), a pixel signal corresponding to the firstphotoelectric conversion unit (e.g., the photodiode 112A) and a pixelsignal corresponding to the second photoelectric conversion unit (e.g.,the photodiode 112B) are added up and generated.

Furthermore, in the read operation of the present technology, it canalso be said that, in a case where the illuminance in the imaging regionof the pixel array unit (or, for example, the calculation result ofFormula (1), (2), or (3)) is smaller than a predetermined thresholdvalue (e.g., the first threshold value Th1 or the second threshold valueTh2), in the first pixel portion (e.g., the pixel 100 of the sixth row(excluding the pixel 100-62 of the second column)) and the second pixelportion (e.g., the pixel 100-62 of the second column), a pixel signalfrom the first photoelectric conversion unit (e.g., the photodiode 112A)and a pixel signal from the second photoelectric conversion unit (e.g.,the photodiode 112B) are read, in a case where the illuminance is largerthan the predetermined threshold value, in the second pixel portion(e.g., the pixel 100-62 of the second column), a pixel signal from thefirst photoelectric conversion unit (e.g., the photodiode 112A) and apixel signal from the second photoelectric conversion unit (e.g., thephotodiode 112B) are read, and meanwhile in the first pixel portion(e.g., the pixel 100 of the sixth row (excluding the pixel 100-62 of thesecond column)), a pixel signal from the first photoelectric conversionunit (e.g., the photodiode 112A) and a pixel signal from the secondphotoelectric conversion unit (e.g., the photodiode 112B) are added upand read.

7. Seventh Embodiment

By the way, in the above-described embodiment, the dual PD-typestructure in which the two photodiodes 112A and 112B are provided forone on-chip lens 111 has been described, but another structure may beadopted. Here, for example, a structure in which four photodiodes 112A,112B, 112C, and 112D are provided for one on-chip lens 111 (hereinafter,also referred to as 2×2 OCL structure) can be adopted.

Therefore, a case where the 2×2 OCL structure is adopted will bedescribed below as the seventh embodiment.

(Example of the 2×2 OCL Structure)

FIG. 16 is a diagram illustrating an example of a structure of pixelshaving the 2×2 OCL structure.

A of FIG. 16 illustrates a plan view of pixels 120 of 8 rows and 8columns (8×8) arranged in a predetermined imaging region when viewedfrom the light incident side among a plurality of pixels 120 arranged inthe pixel array unit 11. Furthermore, B of FIG. 16 illustrates an X-X′cross-section of the pixel 120 illustrated in A of FIG. 16.

As illustrated in FIG. 16, the pixel 120 includes a 2×2 OCL structure inwhich four photodiodes 112A to 112D are provided for one on-chip lens111. It can also be said that the pixel 120 having the 2×2 OCL structureis a pixel portion (first pixel portion or second pixel portion)including an upper left pixel 120A having an upper left photodiode 112A,an upper right pixel 120B having an upper right photodiode 112B, a lowerleft pixel 120C having a lower left photodiode 112C, and a lower rightpixel 120D having a lower right photodiode 112D.

In the pixel 120 having the 2×2 OCL structure, a signal obtained fromthe electric charges accumulated in the photodiodes 112A to 112D is usedas a signal for image acquisition, and a signal obtained from theelectric charges accumulated in each of the photodiodes 112A to 112D canbe used as a signal for phase difference detection.

As described above, the pixel 120 has a structure of the 2×2 OCLstructure and can be used as both an image acquisition pixel and a phasedifference detection pixel.

Furthermore, as illustrated in the cross-sectional view of B of FIG. 16,the pixel 120 includes a color filter 113 below the on-chip lens 111,and is configured as an R pixel 120, a G pixel 120, or a B pixel 120depending on a wavelength component transmitted by the color filter 113.In the pixel array unit 11, the R pixels 120, the G pixels 120, and theB pixels 120 can be arranged in an arrangement pattern such as a Bayerarrangement.

Next, the read function in the case where the 2×2 OCL structure isadopted as the structure of the pixels 120 arranged in the pixel arrayunit 11 will be described.

Note that, here, the configuration of the read function of the presenttechnology is illustrated in FIGS. 19 to 22, and the configuration ofthe current read function is illustrated in FIGS. 17 and 18, and adifference between the read function of the present technology and thecurrent read function will be described. However, as the read functionof the present technology, a first configuration (FIGS. 19 and 20) in acase where the left or right photodiode 112 is independently read and asecond configuration (FIGS. 21 and 22) in a case where the upper orlower photodiode 112 is independently read will be described.

(Configuration of the Read Function)

Similarly to FIGS. 12 to 15 described above, FIGS. 17 to 22 illustrate apartial region of the imaging region in the pixel array unit 11,comparators 151 and a DAC 152 in the column signal processing circuit13.

FIGS. 17 to 22 are different from FIGS. 12 to 15 in that, in the pixelarray unit 11, instead of the pixel 100 having the dual PD-typestructure (FIG. 2), the pixel 120 having the 2×2 OCL structure (FIG. 16)is arranged.

That is, in FIGS. 17 to 22, the pixels 120 arranged in the pixel arrayunit 11 are share pixels in the column direction, and in each pixel 120of the share pixels, the upper left pixel 120A has a photodiode 112A anda transfer transistor TR-Tr-A, and the upper right pixel 120B has aphotodiode 112B and a transfer transistor TR-Tr-B. Furthermore, in eachpixel 120 of the share pixels, the lower left pixel 120C has aphotodiode 112C and a transfer transistor TR-Tr-C, and the lower rightpixel 120D has a photodiode 112D and a transfer transistor TR-Tr-D.

Moreover, in the share pixels, the floating diffusion region FD isshared, and as the pixel circuit of the share pixel, the resettransistor RST-Tr, the amplification transistor AMP-Tr, and theselection transistor SEL-Tr are shared as the shared transistors.

(Contact Arrangement: Current Configuration)

Here, regarding the arrangement of contacts C of the pixels 120, thearrangement is partially different between the configuration of thecurrent read function illustrated in FIGS. 17 and 18 and the readconfiguration of the present technology illustrated in FIGS. 19 to 22.

That is, in the current configuration (FIGS. 17 and 18), in the pixels120 of the first and second rows on the upper side, the contacts C forthe transfer transistor TR-Tr-A connected to the photodiode 112A of theupper left pixel 120A are connected to drive lines TRG2 and TRG6, andthe contacts C for the transfer transistor TR-Tr-B connected to thephotodiode 112B of the upper right pixel 120B are connected to drivelines TRG3 and TRG7.

Furthermore, in the pixels 120 of the first and second rows on the upperside, the contacts C for the transfer transistor TR-Tr-C connected tothe photodiode 112C of the lower left pixel 120C are connected to drivelines TRG0 and TRG4, and the contacts C for the transfer transistorTR-Tr-D connected to the photodiode 112D of the lower right pixel 120Dare connected to drive lines TRG1 and TRG5.

Similarly, in the current configuration (FIGS. 17 and 18), also in thethird and fourth rows on the lower side, the contacts C for the transfertransistor TR-Tr-A are connected to the drive lines TRG2 and TRG6, thecontacts C for the transfer transistor TR-Tr-B are connected to thedrive lines TRG3 and TRG7, the contacts C for the transfer transistorTR-Tr-C are connected to the drive lines TRG0 and TRG4, and the contactsC for the transfer transistor TR-Tr-D are connected to the drive linesTRG1 and TRG5.

(Contact Arrangement: First Configuration of the Present Technology)

On the other hand, in the first configuration of the present technology(FIGS. 19 and 20), the pixels 120 of the first, second, and fourth rowsare similar to the configuration illustrated in FIGS. 17 and 18 suchthat the contacts C for the transfer transistor TR-Tr-A are connected tothe drive lines TRG2 and TRG6, the contacts C for the transfertransistor TR-Tr-B are connected to the drive lines TRG3 and TRG7, thecontacts C for the transfer transistor TR-Tr-C are connected to thedrive lines TRG0 and TRG4, and the contacts C for the transfertransistor TR-Tr-D are connected to the drive lines TRG1 and TRG5.

Here, in the first configuration of the present technology (FIGS. 19 and20), focusing on the pixels 120 of the third row, a drive line TRG20 isadded between the drive line TRG4 and the drive line TRG5, and moreovera drive line TRG21 is added between the drive line TRG6 and the driveline TRG7.

Then, among the pixels 120 of the third row, the pixels 120 of thefirst, second, and fourth columns are similar to the currentconfiguration (FIGS. 17 and 18) such that the contacts C for thetransfer transistors TR-Tr are connected to the corresponding drivelines TRG.

Furthermore, in the pixels 120 of the third row, a pixel 120-33 of thethird column is such that contacts C-33A and C-33C for the left transfertransistors TR-Tr-A and TR-Tr-C are connected to the drive lines TRG6and TRG4, respectively, but contacts C-33B and C-33D for the righttransfer transistors TR-Tr-B and TR-Tr-D are connected to the addeddrive lines TRG21 and TRG20.

That is, in a case where attention is paid to the pixel 120-33, in thefirst configuration (FIGS. 19 and 20) of the present technology, ascompared with the current configuration (FIGS. 17 and 18), theconfigurations are identical in that the contacts C-33A and C-33C areconnected to the drive lines TRG6 and TRG4, but are different in thatthe contacts C-33B and C-33D are connected to the drive lines TRG21 andTRG20, not the drive lines TRG7 and TRG5.

In other words, it can be said that the pixel array unit 11 includes afirst drive line (e.g., drive lines TRG6 and TRG4) connected to a firstphotoelectric conversion unit (e.g., photodiodes 112A and 112C) of afirst pixel portion (e.g., the pixel 120 of the third row (excluding thepixel 120-33 of the third column)) and a second pixel portion (e.g., thepixel 120-33 of the third column), a second drive line (e.g., drivelines TRG7 and TRG5) connected to a second photoelectric conversion unit(e.g., photodiodes 112B and 112D) of the first pixel portion (e.g., thepixel 120 of the third row (excluding the pixel 120-33 of the thirdcolumn)), and a third drive line (e.g., drive lines TRG21 and TRG20)connected to the second photoelectric conversion unit (e.g., photodiodes112B and 112D) of the second pixel portion (e.g., the pixel 120-33 ofthe third column).

At this time, the second drive line (e.g., drive lines TRG7 and TRG5) isnonconnected to the second photoelectric conversion unit (e.g.,photodiodes 112B and 112D) of the second pixel portion (e.g., the pixel120-33 of the third column). Furthermore, the third drive line (e.g.,drive lines TRG21 and TRG20) is nonconnected to the second photoelectricconversion unit (e.g., the photodiodes 112B and 112D) of the first pixelportion (e.g., the pixel 120 of the third row (excluding the pixel120-33 of the third column)). In this way, by providing the two thirddrive lines (e.g., the drive lines TRG21 and TRG20), the pixel 120having the 2×2 OCL structure can be operated independently as the phasedifference detection pixel.

(Contact Arrangement: Second Configuration of the Present Technology)

Furthermore, in the second configuration of the present technology(FIGS. 21 and 22), among the pixels 120 of the third row, focusing onthe pixels 120 of the third row, a drive line TRG30 is added between thedrive line TRG4 and the drive line TRG5, and moreover a drive line TRG31is added between the drive line TRG6 and the drive line TRG7.

Then, in the pixels 120 of the third row, a pixel 120-33 of the thirdcolumn is such that contacts C-33A and C-33B for the upper transfertransistors TR-Tr-A and TR-Tr-B are connected to the drive lines TRG6and TRG7, respectively, but contacts C-33C and C-33D for the lowertransfer transistors TR-Tr-C and TR-Tr-D are connected to the addeddrive line TRG30.

That is, in a case where attention is paid to the pixel 120-33, in thesecond configuration (FIGS. 21 and 22) of the present technology, ascompared with the current configuration (FIGS. 17 and 18), theconfigurations are identical in that the contacts C-33A and C-33B areconnected to the drive lines TRG6 and TRG7, respectively, but aredifferent in that the contacts C-33C and C-33D are connected to thedrive line TRG30, not the drive lines TRG4 and TRG5.

In other words, it can be said that the pixel array unit 11 includes afirst drive line (e.g., drive lines TRG6 and TRG7) connected to a firstphotoelectric conversion unit (e.g., photodiodes 112A and 112B) of afirst pixel portion (e.g., the pixel 120 of the third row (excluding thepixel 120-33 of the third column)) and a second pixel portion (e.g., thepixel 120-33 of the third column), a second drive line (e.g., drivelines TRG4 and TRG5) connected to a second photoelectric conversion unit(e.g., photodiodes 112C and 112D) of the first pixel portion (e.g., thepixel 120 of the third row (excluding the pixel 120-33 of the thirdcolumn)), and a third drive line (e.g., drive line TRG30) connected tothe second photoelectric conversion unit (e.g., photodiodes 112C and112D) of the second pixel portion (e.g., the pixel 120-33 of the thirdcolumn).

At this time, the second drive line (e.g., drive lines TRG4 and TRG5) isnonconnected to the second photoelectric conversion unit (e.g.,photodiodes 112C and 112D) of the second pixel portion (e.g., the pixel120-33 of the third column). Furthermore, the third drive line (e.g.,drive line TRG30) is nonconnected to the second photoelectric conversionunit (e.g., the photodiodes 112C and 112D) of the first pixel portion(e.g., the pixel 120 of the third row (excluding the pixel 120-33 of thethird column)).

(Read Operation: Current Configuration)

Next, a read operation in the case of having the above-describedconfiguration will be described. Here, first of all, the current readoperation will be described with reference to FIGS. 17 and 18.

In FIG. 17, the drive signal SEL0 becomes an H level, and the selectiontransistor SEL-Tr shared by the share pixels including the pixels 120 ofthe third and fourth rows on the lower side is in an ON state, and theshare pixels are selected.

At this time, as illustrated in FIG. 17, among the drive signals TRG0 toTRG7, the drive signal TRG6 becomes an H level, and in the pixels 120 ofthe third row, the transfer transistor TR-Tr-A is in an ON state.Therefore, in the upper left pixel 120A of each pixel 120 of the thirdrow, as indicated by the thick frame in FIG. 17, the electric chargeaccumulated in the photodiode 112A is independently read, and the pixelsignal (A signal) is obtained.

Thereafter, as illustrated in FIG. 18, the drive signal SEL0 remains atan H level, and the drive signals TRG4 to TRG7 become an H level, and inthe pixels 120 of the third row, the transfer transistors TR-Tr-A toTR-Tr-D become an ON state. Therefore, in each pixel 120 of the thirdrow, as indicated by the thick frames in FIG. 18, the electric chargesaccumulated in the photodiodes 112A to 112D are added up and read, andthe pixel signal (A+B+C+D signal) is obtained.

Then, in the current read operation, as illustrated in FIGS. 17 and 18,the A signal is obtained as a signal for phase difference detection, andthe A+B+C+D signal is obtained as a signal for image acquisition.Therefore, in order to acquire a signal corresponding to the B signal,for example, as the signal for phase difference detection, further readoperation or difference processing is required.

(Read Operation: First Configuration of the Present Technology)

Next, the read operation of the first configuration of the presenttechnology will be described with reference to FIGS. 19 and 20.

In FIG. 19, the drive signal SEL0 becomes an H level, and the selectiontransistor SEL-Tr shared by the share pixels including the pixels 120 ofthe third and fourth rows on the lower side is in an ON state, and theshare pixels are selected.

At this time, as illustrated in FIG. 19, among the drive signals TRG0 toTRG7, TRG20, and TRG21, the drive signals TRG4 to TRG7 are at an Hlevel, and in each pixel 120 of the third row (excluding the pixel 120of the third column), the transfer transistors TR-Tr-A to TR-Tr-D becomean ON state simultaneously.

Therefore, in each pixel 120 of the third row (excluding the pixels 120of the third column), as indicated by the thick frames in FIG. 19, theelectric charges accumulated in the photodiodes 112A to 112D are addedup and read, and the pixel signal (A+B+C+D signal) is obtained.

Here, among the pixels 120 of the third row, focusing on the pixel120-33 of the third column, as described above, in the upper right pixel120B and the lower right pixel 120D, the contacts C-33B and C-33D areconnected to the drive lines TRG21 and TRG20, and the drive signalsTRG21 and TRG20 applied to the drive lines are at an L level. Therefore,in the pixel 120-33, only the left transfer transistors TR-Tr-A andTR-Tr-C become an ON state.

Therefore, in the pixel 120-33, as indicated by the thick frame in FIG.19, the electric charges accumulated in the left photodiodes 112A and112C are independently read, and the pixel signal (A+C signal) isobtained.

Furthermore, although illustration is omitted, the pixels 120 arrangedin the pixel array unit 11 include pixels 120 in which only the electriccharges accumulated in the right photodiodes 112B and 112D are read andthe pixel signal (B+D signal) can be acquired in contrast to the pixel120-33. For example, if the pixel 120-33 described above is the pixel120 capable of acquiring the B+D signal, it is only required to connectthe contacts C-33A and C-33C to the drive lines TRG21 and TRG20 insteadof the drive lines TRG6 and TRG4, and connect the contacts C-33B andC-33D to the drive lines TRG7 and TRG5.

That is, the pixels 120 arranged in the pixel array unit 11 includepixels 120 capable of acquiring the A+B+C+D signal as the imageacquisition pixel, and pixels 120 capable of acquiring the left A+Csignal and pixels 120 capable of acquiring the right B+D signal as thephase difference detection pixel. Here, as indicated in theabove-described first to fourth embodiments, the density of the pixels120 operating as the phase difference detection pixels is determined onthe basis of the gain, the luminance level, and the like (for example,3% or the like in the case of the drive control A), and the pixel 120according to the density operates as the phase difference detectionpixel for obtaining the A+C signal or the B+D signal.

Then, in the read operation of the present technology, as illustrated inFIG. 19, the A+C signal and the B+D signal are obtained as signals forphase difference detection, and the A+B+C+D signal is obtained as asignal for image acquisition. Therefore, in order to acquire a signalfor phase difference detection, it is only necessary to perform the readoperation once. That is, in the above-described current read operation,it was necessary to perform reading a plurality of times in order toacquire the signal for phase difference detection, but in the readoperation of the present technology, it is possible to reduce the numberof times of read operation to one.

Note that in a case where the pixel 120-33 is caused to operate as theimage acquisition pixel, as illustrated in FIG. 20, the drive signalSEL0 is set to an H level state, and moreover the drive signals TRG4 toTRG7 and the drive signals TRG20 and TRG21 are set to an H level.Therefore, in the pixel 120-33, similarly to the other pixels 120 of thethird row, the transfer transistors TR-Tr-A to TR-Tr-D aresimultaneously set to an ON state, and as indicated by the thick framein FIG. 20, the electric charges accumulated in the photodiodes 112A to112D are added up and read, and the pixel signal (A+B+C+D signal) isobtained.

(Read Operation: Second Configuration of the Present Technology)

Next, the read operation of the second configuration of the presenttechnology will be described with reference to FIGS. 21 and 22.

In FIG. 21, the drive signal SEL0 becomes an H level, and the selectiontransistor SEL-Tr shared by the share pixels including the pixels 120 ofthe third and fourth rows on the lower side is in an ON state, and theshare pixels are selected.

At this time, as illustrated in FIG. 21, among the drive signals TRG0 toTRG7, TRG30, and TRG31, the drive signals TRG4 to TRG7 are at an Hlevel, and in each pixel 120 of the third row (excluding the pixel 120of the third column), the transfer transistors TR-Tr-A to TR-Tr-D becomean ON state simultaneously.

Therefore, in each pixel 120 of the third row (excluding the pixels 120of the third column), as indicated by the thick frames in FIG. 21, theelectric charges accumulated in the photodiodes 112A to 112D are addedup and read, and the pixel signal (A+B+C+D signal) is obtained.

Here, among the pixels 120 of the third row, focusing on the pixel120-33 of the third column, as described above, in the lower left pixel120C and the lower right pixel 120D, the contacts C-33B and C-33D areconnected to the drive line TRG30, and the drive signal TRG30 applied tothe drive line is at an L level. Therefore, in the pixel 120-33, onlythe upper transfer transistors TR-Tr-A and TR-Tr-B become an ON state.

Therefore, in the pixel 120-33, as indicated by the thick frame in FIG.21, the electric charges accumulated in the upper photodiodes 112A and112B are independently read, and the pixel signal (A+B signal) isobtained.

Furthermore, although illustration is omitted, the pixels 120 arrangedin the pixel array unit 11 include pixels 120 in which only the electriccharges accumulated in the lower photodiodes 112C and 112D are read andthe pixel signal (C+D signal) can be acquired in contrast to the pixel120-33. If the pixel 120-33 described above is the pixel 120 capable ofacquiring the C+D signal, it is only required to connect the contactsC-33A and C-33B to the drive line TRG31 together instead of the drivelines TRG6 and TRG7, and connect the contacts C-33C and C-33D to thedrive lines TRG4 and TRG5.

That is, the pixels 120 arranged in the pixel array unit 11 includepixels 120 capable of acquiring the A+B+C+D signal as the imageacquisition pixel, and pixels 120 capable of acquiring the upper A+Bsignal and pixels 120 capable of acquiring the lower C+D signal as thephase difference detection pixel. Here, as indicated in theabove-described first to fourth embodiments, the density of the pixels120 operating as the phase difference detection pixels is determined onthe basis of the gain, the luminance level, and the like (for example,3% or the like in the case of the drive control A), and the pixel 120according to the density operates as the phase difference detectionpixel for obtaining the A+B signal or the C+D signal.

Then, in the read operation of the present technology, as illustrated inFIG. 21, the A+B signal and the C+D signal are obtained as signals forphase difference detection, and the A+B+C+D signal is obtained as asignal for image acquisition. Therefore, in order to acquire a signalfor phase difference detection, it is only necessary to perform the readoperation once. That is, in the above-described current read operation,it was necessary to perform reading a plurality of times in order toacquire the signal for phase difference detection, but in the readoperation of the present technology, it is possible to reduce the numberof times of read operation to one.

Note that in a case where the pixel 120-33 is caused to operate as theimage acquisition pixel, as illustrated in FIG. 22, the drive signalSEL0 is set to an H level state, and moreover the drive signals TRG4 toTRG7 and the drive signals TRG30 and TRG31 are set to an H level.Therefore, in the pixel 120-33, similarly to the other pixels 120 of thethird row, the transfer transistors TR-Tr-A to TR-Tr-D aresimultaneously set to an ON state, and as indicated by the thick framein FIG. 22, the electric charges accumulated in the photodiodes 112A to112D are added up and read, and the pixel signal (A+B+C+D signal) isobtained.

8. Variation

In the above description, the pixels 100 or pixels 120 arranged in thepixel array unit 11 are described as being configured as the first pixelportion or the second pixel portion depending on the form of connectionwith the drive lines TRG. However, these pixel portions can be pixelunits having one or more photoelectric conversion units (for example,photodiodes). For example, the pixel unit can have an even number ofphotoelectric conversion units (for example, photodiodes).

More specifically, the pixel 100 configured as the first pixel portionor the second pixel portion has two photoelectric conversion units: thephotodiode 112A of the left pixel 100A and the photodiode 112B of theright pixel 100B. Furthermore, the pixel 120 configured as the firstpixel portion or the second pixel portion has four photoelectricconversion units: the photodiode 112A of the upper left pixel 120A, thephotodiode 112B of the upper right pixel 120B, the photodiode 112C ofthe lower left pixel 120C, and the photodiode 112D of the lower rightpixel 120D.

Note that, in the above description, the case where the first pixelportion or the second pixel portion is a pixel unit having two or fourphotoelectric conversion units is described, but more photoelectricconversion units such as a pixel unit having, for example, eightphotoelectric conversion units, may be provided. Furthermore, in theabove description, the case where the electric charge accumulated in thephotodiode 112A or the photodiode 112B is independently read in thepixel portion has been mainly described, but, as described above, theelectric charges accumulated in the photodiode 112A and the photodiode112B may be independently read.

Furthermore, in the above-described embodiments, the case is describedwhere the AE unit 212 functions as the illuminance detection unit thatdetects the illuminance in the imaging region of the pixel array unit 11on the basis of the exposure information set in the solid-state imagingelement 10, but the method for detecting the illuminance is not limitedthereto.

That is, in the above-described embodiments, the AE unit 212 detects theilluminance in the imaging region of the pixel array unit 11 on thebasis of the exposure amount obtained from the image frame preceding atarget image frame, but, for example, an image frame for detecting theilluminance may be separately generated. Furthermore, an illuminancesensor for detecting illuminance may be provided. The illuminance sensorcan be provided inside or outside the solid-state imaging element 10 (ata position different from the solid-state imaging element 10).

Moreover, in the above-described embodiments, as the information relatedto the accuracy of the phase difference detection used for the thresholdvalue determination together with the gain depending on the illuminance(hereinafter, also referred to as the accuracy-related information), theluminance level in the target region in the target image frame(luminance level of the above Formula (1)), the number of effectivepixels among the pixels used for phase difference detection (the numberof effective phase difference detection pixels of the above Formula(2)), and the size of the region of interest in the target image frame(ROI area of the above Formula (3)) are described, but theaccuracy-related information is not limited thereto.

That is, the luminance level, the number of effective phase differencedetection pixels, and the ROI area described in the above embodimentsare examples of accuracy-related information. Furthermore, it can alsobe said that the luminance level detection unit 213 of the control unit200A (FIG. 5), the phase difference detection unit 214 and the countingunit 215 of the control unit 200B (FIG. 7), and the ROI setting unit 216of the control unit 200C (FIG. 9) are an acquisition unit that acquiresthe accuracy-related information related to the accuracy of phasedifference detection.

Note that, in the above-described embodiments, as the imaging apparatus,the imaging apparatus 1A (FIGS. 5 and 11), the imaging apparatus 1B(FIG. 7), and the imaging apparatus 1C (FIG. 9) are described, but thesolid-state imaging element 10 (FIG. 1 and the like) may be understoodto be an imaging apparatus. That is, it can also be said that thesolid-state imaging element 10 is, for example, a CMOS image sensor andis an imaging apparatus.

In the above-described embodiments, as the structure of the pixels 100or pixels 120 arranged in the pixel array unit 11, the dual PD-typestructure and the 2×2 OCL structure are described, but other structuresmay be adopted. In short, as the pixels arranged in the pixel array unit11, it is sufficient if pixels can be used as image acquisition pixelsor phase difference detection pixels, and their structure is arbitrary.Note that the phase difference detection pixel is a pixel for imageplane phase difference AF, and is also called a phase detection autofocus (PDAF) pixel or the like.

Furthermore, in the above-described embodiments, as the solid-stateimaging element 10, a CMOS image sensor is described as an example, butthe application is not limited to the CMOS image sensor, but it isapplicable to general solid-state imaging elements in which pixels aretwo-dimensionally arranged, e.g., a charge coupled device (CCD) imagesensor. Moreover, the present technology is applicable not only to asolid-state imaging element that detects the distribution of theincident light amount of visible light and captures it as an image, butalso to general solid-state imaging elements that capture thedistribution of the incident light amount of particles or the like as animage.

9. Configuration of Electronic Equipment

FIG. 23 is a block diagram illustrating a configuration example ofelectronic equipment including a solid-state imaging element to whichthe present technology is applied.

Electronic equipment 1000 is electronic equipment with an imagingfunction, such as an imaging apparatus including a digital still camera,a video camera, or the like, a mobile terminal apparatus including asmartphone, a tablet terminal, or a mobile phone, and the like, forexample.

The electronic equipment 1000 includes a lens unit 1011, an imaging unit1012, a signal processing unit 1013, a control unit 1014, a display unit1015, a recording unit 1016, an operation unit 1017, a communicationunit 1018, a power source unit 1019, and a drive unit 1020. Furthermore,the signal processing unit 1013, the control unit 1014, the display unit1015, the recording unit 1016, the operation unit 1017, thecommunication unit 1018, and the power source unit 1019 are connected toeach other through a bus 1021 in the electronic equipment 1000.

The lens unit 1011 includes a zoom lens, a focus lens, and the like andcondenses light from a subject. The light (subject light) condensed bythe lens unit 1011 enters the imaging unit 1012.

The imaging unit 1012 includes a solid-state imaging element to whichthe present technology has been applied (for example, the solid-stateimaging element 10 of FIG. 1). The imaging unit 1012 photoelectricallyconverts the light (subject light) received through the lens unit 1011into an electrical signal and supplies the resultant signal to thesignal processing unit 1013.

Note that, in the imaging unit 1012, the pixel array unit 11 of thesolid-state imaging element 10 includes pixels 100 (or pixels 120) aspixels that are regularly arranged in a predetermined arrangementpattern. The pixel 100 (or the pixel 120) can be used as an imageacquisition pixel or a phase difference detection pixel. Here, theimaging unit 1012 may be considered as a solid-state imaging element towhich the present technology is applied.

The signal processing unit 1013 is a signal processing circuit thatprocesses a signal supplied from the imaging unit 1012. For example, thesignal processing unit 1013 includes a digital signal processor (DSP)circuit and the like.

The signal processing unit 1013 processes the signal from the imagingunit 1012 to generate image data of a still image or a moving image, andsupplies the image data to the display unit 1015 or the recording unit1016. Furthermore, the signal processing unit 1013 generates data fordetecting the phase difference (phase difference detection data) on thebasis of the signal from the imaging unit 1012 (phase differencedetection pixel) and supplies the data to the control unit 1014.

The control unit 1014 includes, for example, a central processing unit(CPU), a microprocessor, and the like. The control unit 1014 controlsthe operation of each unit of the electronic equipment 1000.

The display unit 1015 includes, for example, a display apparatus, suchas a liquid crystal display (LCD) and an organic electro luminescence(EL) display. The display unit 1015 processes the image data suppliedfrom the signal processing unit 1013 and displays the still images orthe moving images captured by the imaging unit 1012.

The recording unit 1016 includes, for example, a recording medium, suchas a semiconductor memory, a hard disk, and an optical disk. Therecording unit 1016 records the image data supplied from the signalprocessing unit 1013. Furthermore, the recording unit 1016 outputsrecorded image data according to control from the control unit 1014.

The operation unit 1017 includes, for example, physical buttons as wellas a touch panel in combination with the display unit 1015. Theoperation unit 1017 outputs operation commands regarding variousfunctions of the electronic equipment 1000 according to operation by theuser. The control unit 1014 controls operation of each unit on the basisof the operation commands supplied from the operation unit 1017.

The communication unit 1018 includes, for example, a communicationinterface circuit or the like. The communication unit 1018 exchangesdata with external equipment through wireless communication or wiredcommunication according to a predetermined communication standard.

The power source unit 1019 appropriately supplies various power sourcesas operation power sources of the imaging unit 1012, the signalprocessing unit 1013, the control unit 1014, the display unit 1015, therecording unit 1016, the operation unit 1017, the communication unit1018, and the drive unit 1020 to these supply targets.

Furthermore, the control unit 1014 detects the phase difference betweentwo images on the basis of the phase difference detection data suppliedfrom the signal processing unit 1013. Then, the control unit 1014determines whether or not the object as a target of focusing (object tobe focused) is focused on the basis of the detection result of the phasedifference. The control unit 1014 calculates an amount of deviation offocus (amount of defocus) in a case where the object to be focused isnot focused and supplies the amount of defocus to the drive unit 1020.

The drive unit 1020 includes, for example, a motor or the like anddrives the lens unit 1011 including the zoom lens, the focus lens, andthe like.

The drive unit 1020 calculates an amount of drive of the focus lens ofthe lens unit 1011 on the basis of the amount of defocus supplied fromthe control unit 1014 and moves the focus lens according to the amountof drive. Note that the drive unit 1020 maintains the current positionof the focus lens in a case where the object to be focused is focused.In this way, the image plane phase difference AF is performed.

The electronic equipment 1000 is configured as described above.

10. Example of Use of the Solid-State Imaging Element

FIG. 24 is a diagram illustrating a usage example of the solid-stateimaging element to which the present technology is applied.

The solid-state imaging element 10 (FIG. 1) can be used in, for example,various cases of sensing light, such as visible light, infrared light,ultraviolet light, and X rays, and the like. That is, as illustrated inFIG. 24, the solid-state imaging element 10 can be used in apparatusesused not only in a field of viewing in which images to be viewed arecaptured, but also in a field of traffic, a field of home appliance, afield of medical and healthcare, a field of security, a field of beauty,a field of sports, a field of agriculture, or the like, for example.

Specifically, in the field of viewing, the solid-state imaging element10 can be used in, for example, an apparatus (for example, electronicequipment 1000 of FIG. 23) for capturing an image to be viewed, such asa digital camera, a smartphone, and a mobile phone with a camerafunction.

In the field of traffic, the solid-state imaging element 10 can be usedin, for example, an apparatus used for traffic, such as an on-boardsensor that captures images of the front, back, surroundings, inside ofa car, or the like, a monitoring camera that monitors traveling vehiclesor roads, and a distance measurement sensor that measures the distancebetween vehicles and the like, for safe drive like automatic stop or forrecognizing the state of the driver.

In the field of home appliance, the solid-state imaging element 10 canbe used in, for example, an apparatus used as a home appliance, such asa television receiver, a refrigerator, and an air conditioner, thatcaptures an image of a gesture of the user to perform equipmentoperation according to the gesture. Furthermore, in the field of medicaland healthcare, the solid-state imaging element 10 can be used in, forexample, an apparatus used for medical or healthcare, such as anendoscope and an apparatus that captures images of blood vessels byreceiving infrared light.

In the field of security, the solid-state imaging element 10 can be usedin, for example, an apparatus used for security, such as a monitoringcamera for crime prevention and a camera for personal authentication.Furthermore, in the field of beauty, the solid-state imaging element 10can be used in, for example, an apparatus used for beauty, such as askin measurement device that captures images of the skin and amicroscope that captures images of the scalp.

In the field of sports, the solid-state imaging element 10 can be usedin, for example, an apparatus used for sports, such as an action cameraand a wearable camera for sports and the like. Furthermore, in the fieldof agriculture, the solid-state imaging element 10 can be used in, forexample, an apparatus used for agriculture, such as a camera thatmonitors the state of a farm or produce.

11. Application Examples to Mobile Objects

The technology according to the present disclosure (present technology)is applicable to a variety of products. For example, the technologyaccording to the present disclosure may be implemented as apparatusesmounted on any type of movable bodies such as automobiles, electricvehicles, hybrid electric vehicles, motorcycles, bicycles, personalmobilities, airplanes, drones, ships, or robots.

FIG. 25 is a block diagram illustrating a schematic configurationexample of a vehicle control system, which is an example of a movablebody control system to which the technology according to the presentdisclosure can be applied.

The vehicle control system 12000 includes a plurality of electroniccontrol units connected via a communication network 12001. In theexample illustrated in FIG. 25, the vehicle control system 12000includes a drive line control unit 12010, a body system control unit12020, a vehicle outside information detecting unit 12030, a vehicleinside information detecting unit 12040, and an integrated control unit12050. Furthermore, a microcomputer 12051, an audio and image outputunit 12052, and an in-vehicle network interface (I/F) 12053 areillustrated as functional configurations of the integrated control unit12050.

The drive line control unit 12010 controls the operation of apparatusesrelated to the drive line of the vehicle in accordance with a variety ofprograms. For example, the drive line control unit 12010 functions as acontrol apparatus for a driving force generating apparatus such as aninternal combustion engine or a driving motor that generates the drivingforce of the vehicle, a driving force transferring mechanism thattransfers the driving force to wheels, a steering mechanism that adjuststhe steering angle of the vehicle, a braking apparatus that generatesthe braking force of the vehicle, and the like.

The body system control unit 12020 controls the operations of a varietyof apparatuses attached to the vehicle body in accordance with a varietyof programs. For example, the body system control unit 12020 functionsas a control apparatus for a keyless entry system, a smart key system, apower window apparatus, or a variety of lights such as a headlight, abackup light, a brake light, a blinker, or a fog lamp. In this case, thebody system control unit 12020 can receive radio waves transmitted froma portable device that serves instead of the key or signals of a varietyof switches. The body system control unit 12020 accepts input of theseradio waves or signals, and controls the door lock apparatus, the powerwindow apparatus, the lights, or the like of the vehicle.

The vehicle outside information detecting unit 12030 detects informationregarding the outside of the vehicle including the vehicle controlsystem 12000. For example, the imaging unit 12031 is connected to thevehicle outside information detecting unit 12030. The vehicle outsideinformation detecting unit 12030 causes the imaging unit 12031 tocapture images of the outside of the vehicle, and receives the capturedimage. The vehicle outside information detecting unit 12030 may performprocessing of detecting an object such as a person, a car, an obstacle,a traffic sign, or a letter on a road, or processing of detecting thedistance on the basis of the received image.

The imaging unit 12031 is an optical sensor that receives light andoutputs an electric signal corresponding to the amount of receivedlight. The imaging unit 12031 can output the electric signal as theimage or output the electric signal as ranging information. Furthermore,the light received by the imaging unit 12031 may be visible light orinvisible light such as infrared light.

The vehicle inside information detecting unit 12040 detects informationof the inside of the vehicle. The vehicle inside information detectingunit 12040 is connected, for example, to a driver state detecting unit12041 that detects the state of the driver. The driver state detectingunit 12041 includes, for example, a camera that images a driver, and thevehicle inside information detecting unit 12040 may compute the degreeof the driver's tiredness or the degree of the driver's concentration ordetermine whether or not the driver has a doze, on the basis ofdetection information input from the driver state detecting unit 12041.

The microcomputer 12051 can calculate a control target value of thedriving force generating apparatus, the steering mechanism, or thebraking apparatus on the basis of information regarding the inside andoutside of the vehicle acquired by the vehicle outside informationdetecting unit 12030 or the vehicle inside information detecting unit12040, and output a control instruction to the drive line control unit12010. For example, the microcomputer 12051 can perform cooperativecontrol for the purpose of executing the functions of the advanceddriver assistance system (ADAS) including vehicle collision avoidance orimpact reduction, follow-up driving based on the inter-vehicle distance,constant vehicle speed driving, vehicle collision warning, vehicle lanedeviation warning, or the like.

Furthermore, the microcomputer 12051 can perform cooperative control forthe purpose of automatic driving or the like for autonomous runningwithout depending on the driver's operation through control of thedriving force generating apparatus, the steering mechanism, the brakingapparatus, or the like on the basis of information around the vehicleacquired by the vehicle outside information detecting unit 12030 or thevehicle inside information detecting unit 12040.

Furthermore, the microcomputer 12051 can output a control instruction tothe body system control unit 12020 on the basis of the informationoutside the vehicle obtained by the vehicle outside informationdetecting unit 12030. For example, the microcomputer 12051 can performthe cooperative control for realizing glare protection such ascontrolling the head light according to a position of a precedingvehicle or an oncoming vehicle detected by the vehicle outsideinformation detecting unit 12030 to switch a high beam to a low beam.

The audio and image output unit 12052 transmits an output signal of atleast one of a sound or an image to an output apparatus capable ofvisually or aurally notifying a passenger of the vehicle or the outsideof the vehicle of information. In the example of FIG. 25, an audiospeaker 12061, a display unit 12062, and an instrument panel 12063 areexemplified as the output apparatus. For example, the display unit 12062may include at least one of an onboard display or a head-up display.

FIG. 26 is a view illustrating an example of an installation position ofthe imaging unit 12031.

In FIG. 26, a vehicle 12100 includes imaging units 12101, 12102, 12103,12104, and 12105 as the imaging unit 12031.

Imaging units 12101, 12102, 12103, 12104 and 12105 are positioned, forexample, at the front nose, a side mirror, the rear bumper, the backdoor, the upper part of the windshield in the vehicle compartment, orthe like of the vehicle 12100. The imaging unit 12101 attached to thefront nose and the imaging unit 12105 attached to the upper part of thewindshield in the vehicle compartment mainly acquire images of the areaahead of the vehicle 12100. The imaging units 12102 and 12103 attachedto the side mirrors mainly acquire images of the areas on the sides ofthe vehicle 12100. The imaging unit 12104 attached to the rear bumper orthe back door mainly acquires images of the area behind the vehicle12100. The forward images acquired by the imaging units 12101 and 12105are mainly used for detecting a preceding vehicle, a pedestrian, anobstacle, a traffic light, a traffic sign, a lane, and the like.

Note that FIG. 26 illustrates an example of the respective imagingranges of the imaging units 12101 to 12104. An imaging range 12111represents the imaging range of the imaging unit 12101 attached to thefront nose. Imaging ranges 12112 and 12113 respectively represent theimaging ranges of the imaging units 12102 and 12103 attached to the sidemirrors. An imaging range 12114 represents the imaging range of theimaging unit 12104 attached to the rear bumper or the back door. Forexample, overlaying image data captured by the imaging units 12101 to12104 offers an overhead image that looks down on the vehicle 12100.

At least one of the imaging units 12101 to 12104 may have a function ofobtaining distance information. For example, at least one of the imagingunits 12101 to 12104 may be a stereo camera including a plurality ofimage sensors, or may be an image sensor having pixels for phasedifference detection.

For example, the microcomputer 12051 may extract especially a closestthree-dimensional object on a traveling path of the vehicle 12100, thethree-dimensional object traveling at a predetermined speed (forexample, 0 km/h or higher) in a direction substantially the same as thatof the vehicle 12100 as the preceding vehicle by determining a distanceto each three-dimensional object in the imaging ranges 12111 to 12114and change in time of the distance (relative speed relative to thevehicle 12100) on the basis of the distance information obtained fromthe imaging units 12101 to 12104. Moreover, the microcomputer 12051 canset an inter-vehicle distance to be secured in advance from thepreceding vehicle, and can perform automatic brake control (includingfollow-up stop control), automatic acceleration control (includingfollow-up start control), and the like. In this manner, it is possibleto perform the cooperative control for realizing automatic driving orthe like to autonomously travel independent from the operation of thedriver.

For example, the microcomputer 12051 can extract three-dimensionalobject data regarding the three-dimensional object while sorting thedata into a two-wheeled vehicle, a regular vehicle, a large vehicle, apedestrian, and other three-dimensional object such as a utility pole onthe basis of the distance information obtained from the imaging units12101 to 12104 and use the data for automatically avoiding obstacles.For example, the microcomputer 12051 discriminates obstacles around thevehicle 12100 into an obstacle visibly recognizable to a driver of thevehicle 12100 and an obstacle difficult to visually recognize. Then, themicrocomputer 12051 determines a collision risk indicating a degree ofrisk of collision with each obstacle, and when the collision risk isequal to or higher than a set value and there is a possibility ofcollision, the microcomputer 12051 can perform driving assistance foravoiding the collision by outputting an alarm to the driver via theaudio speaker 12061 and the display unit 12062 or performing forceddeceleration or avoidance steering via the drive line control unit12010.

At least one of the imaging units 12101 to 12104 may be an infraredcamera for detecting infrared rays. For example, the microcomputer 12051can recognize a pedestrian by determining whether or not there is apedestrian in the captured images of the imaging units 12101 to 12104.Such pedestrian recognition is carried out, for example, by a procedureof extracting feature points in the captured images of the imaging units12101 to 12104 as infrared cameras and a procedure of performing patternmatching processing on a series of feature points indicating an outlineof an object to discriminate whether or not the object is a pedestrian.When the microcomputer 12051 determines that there is a pedestrian inthe captured images of the imaging units 12101 to 12104 and recognizesthe pedestrian, the audio and image output unit 12052 causes the displayunit 12062 to superimpose a rectangular contour for emphasis on therecognized pedestrian. Furthermore, the audio and image output unit12052 may causes the display unit 12062 to display icons or the likeindicating pedestrians at desired positions.

An example of the vehicle control system to which the technologyaccording to the present disclosure is applicable is heretoforedescribed. The technology according to the present disclosure can beapplied to the imaging unit 12031 among the configurations describedabove. Specifically, the solid-state imaging element 10 of FIG. 1 can beapplied to the imaging unit 12031. By applying the technology accordingto the present disclosure to the imaging unit 12031, the frame rate canbe increased and a captured image that is easier to see can be obtained,so that fatigue of the driver can be reduced.

12. Application Example to Endoscopic Surgery System

The technology according to the present disclosure (present technology)is applicable to a variety of products. For example, the technologyaccording to the present disclosure may be applied to an endoscopicsurgery system.

FIG. 27 is a diagram illustrating an example of a schematicconfiguration of an endoscopic surgery system to which the technology(present technology) according to the present disclosure can be applied.

FIG. 27 illustrates a situation where an operator (doctor) 11131 isperforming surgery on a patient 11132 on a patient bed 11133 using theendoscopic surgery system 11000. As illustrated, the endoscopic surgerysystem 11000 includes an endoscope 11100, other surgical tools 11110,e.g., a pneumoperitoneum tube 11111, an energy treatment tool 11112, orthe like, a support arm apparatus 11120 supporting the endoscope 11100,and a cart 11200 on which various apparatuses for an endoscopic surgeryare mounted.

The endoscope 11100 includes a lens tube 11101 in which a region of apredetermined length from a tip end, is inserted into the body cavity ofthe patient 11132, and a camera head 11102 connected to a base end ofthe lens tube 11101. In the illustrated example, the endoscope 11100configured as a so-called rigid scope including a rigid lens tube 11101,is illustrated, but the endoscope 11100 may be configured as a so-calledflexible scope including a flexible lens tube.

An opening portion into which an objective lens is fitted, is providedon the tip end of the lens tube 11101. A light source apparatus 11203 isconnected to the endoscope 11100, and light generated by the lightsource apparatus 11203 is guided to the tip end of the lens tube by alight guide provided to extend in the lens tube 11101, and is emittedtowards an observation target in the body cavity of the patient 11132through the objective lens. Note that the endoscope 11100 may be aforward-viewing endoscope, or may be an oblique-viewing endoscope or aside-viewing endoscope.

In the camera head 11102, an optical system and an imaging element areprovided, and reflection light (observation light) from the observationtarget, is condensed in the image sensor by the optical system. Theobservation light is subjected to the photoelectric conversion by theimage sensor, and an electrical signal corresponding to the observationlight, that is, an image signal corresponding to an observation image,is generated. The image signal is transmitted to a camera control unit(CCU) 11201, as RAW data.

The CCU 11201 includes a central processing unit (CPU), a graphicsprocessing unit (GPU), or the like, and integrally controls theoperation of the endoscope 11100 and the display apparatus 11202.Moreover, the CCU 11201 receives the image signal from the camera head11102 and performs various image processing for displaying the imagebased on the image signal, for example, as development processing(demosaic processing) or the like, on the image signal.

The display apparatus 11202 displays an image based on the image signalsubjected to the image processing by the CCU 11201 according to thecontrol from the CCU 11201.

The light source apparatus 11203, for example, includes a light sourcesuch as a light emitting diode (LED) or the like, and supplies theirradiation light at the time of capturing the surgery site to theendoscope 11100.

The input apparatus 11204 is an input interface with respect to theendoscopic surgery system 11000. The user is capable of performing theinput of various information items, or the input of an instruction withrespect to endoscopic surgery system 11000, through the input apparatus11204. For example, the user inputs an instruction or the like to changeconditions of imaging (type of irradiation light, magnification, focallength, and the like) by the endoscope 11100.

The treatment tool control apparatus 11205 controls the driving of theenergy treatment tool 11112 for the cauterization and the incision ofthe tissue, the sealing of the blood vessel, or the like. In order toensure a visual field of the endoscope 11100 and to ensure a workingspace of the surgery operator, the pneumoperitoneum apparatus 11206sends gas into the body cavity through the pneumoperitoneum tube 11111such that the body cavity of the patient 11132 is inflated. The recorder11207 is an apparatus capable of recording various information itemsassociated with the surgery. The printer 11208 is an apparatus capableof printing various information items associated with the surgery, invarious formats such as a text, an image, or a graph.

Note that the light source apparatus 11203 that supplies irradiationlight when capturing the surgical site to the endoscope 11100 can beconfigured from, for example, a white light source configured by an LED,a laser light source, or a combination thereof. In a case where thewhite light source includes a combination of RGB laser light sources, itis possible to control an output intensity and an output timing of eachcolor (each wavelength) with a high accuracy, and thus, it is possibleto adjust a white balance of the captured image with the light sourceapparatus 11203. Furthermore, in this case, laser light from each of theRGB laser light sources is emitted to the observation target in a timedivision manner, and the driving of the image sensor of the camera head11102 is controlled in synchronization with the emission timing, andthus, it is also possible to capture an image corresponding to each ofRGB in a time division manner. According to such a method, it ispossible to obtain a color image without providing a color filter in theimage sensor.

Furthermore, the driving of the light source apparatus 11203 may becontrolled such that the intensity of the light to be output is changedfor each predetermined time. The driving of the image sensor of thecamera head 11102 is controlled in synchronization with a timing whenthe intensity of the light is changed, images are acquired in a timedivision manner, and the images are synthesized, and thus, it ispossible to generate an image of a high dynamic range, without so-calledblack defects and overexposure.

Furthermore, the light source apparatus 11203 may be configured tosupply light of a predetermined wavelength band corresponding to speciallight imaging. In the special light imaging, for example, light of anarrow band is applied, compared to irradiation light at the time ofperforming usual observation by using wavelength dependency of absorbinglight in the body tissue (i.e., white light), and thus, so-called narrowband imaging of capturing a predetermined tissue of a blood vessel orthe like in a superficial portion of a mucous membrane with a highcontrast, is performed. Alternatively, in the special light imaging,fluorescent light imaging of obtaining an image by fluorescent lightgenerated by being irradiated with excited light, may be performed. Inthe fluorescent light imaging, for example, the body tissue isirradiated with the excited light, and the fluorescent light from thebody tissue is observed (autofluorescent light imaging), or a reagentsuch as indocyanine green (ICG) is locally injected into the bodytissue, and the body tissue is irradiated with excited lightcorresponding to a fluorescent light wavelength of the reagent, andthus, a fluorescent image is obtained. The light source apparatus 11203can be configured to supply the narrow band light and/or the excitedlight corresponding to such special light imaging.

FIG. 28 is a block diagram illustrating an example of a functionalconfiguration of the camera head 11102 and the CCU 11201 illustrated inFIG. 27.

The camera head 11102 includes a lens unit 11401, an imaging unit 11402,a drive unit 11403, a communication unit 11404, and a camera headcontrol unit 11405. The CCU 11201 includes a communication unit 11411,an image processing unit 11412, and a control unit 11413. The camerahead 11102 and the CCU 11201 are connected to be capable of mutualcommunication through a transmission cable 11400.

The lens unit 11401 is an optical system provided in a connectionportion with the lens tube 11101. Observation light incorporated from atip end of the lens tube 11101 is guided to the camera head 11102 and isincident on the lens unit 11401. The lens unit 11401 includes acombination of a plurality of lenses including a zoom lens and a focuslens.

The imaging unit 11402 includes an imaging element. The image sensorconstituting the imaging unit 11402 may be one (so-called single platetype) or plural (so-called multi-plate type). In a case where theimaging unit 11402 is configured as a multi-plate type, for example,image signals corresponding to RGB may be generated by each imagesensor, and a color image may be obtained by combining them.Alternatively, the imaging unit 11402 may include a pair of imagesensors for respectively acquiring right-eye and left-eye image signalscorresponding to 3D (dimensional) display. The 3D display is performed,and thus, the surgery operator 11131 is capable of more accuratelygrasping the depth of the biological tissue in the surgery portion. Notethat, in a case where the imaging unit 11402 is configured by amulti-plate type configuration, a plurality of lens units 11401 may beprovided corresponding to each of the image sensors.

Furthermore, the imaging unit 11402 may not be necessarily provided inthe camera head 11102. For example, the imaging unit 11402 may beprovided immediately after the objective lens, in the lens tube 11101.

The drive unit 11403 includes an actuator, and moves the zoom lens andthe focus lens of the lens unit 11401 along the optical axis by apredetermined distance, according to the control from the camera headcontrol unit 11405. Therefore, it is possible to suitably adjust themagnification and the focal point of the image captured by the imagingunit 11402.

The communication unit 11404 includes a communication apparatus fortransmitting and receiving various information items with respect to theCCU 11201. The communication unit 11404 transmits the image signalobtained from the imaging unit 11402 to the CCU 11201 through thetransmission cable 11400, as the RAW data.

Furthermore, the communication unit 11404 receives a control signal forcontrolling the driving of the camera head 11102 from the CCU 11201 andsupplies the control signal to the camera head control unit 11405. Thecontrol signal, for example, includes information associated with theimaging condition, such as information of designating a frame rate ofthe captured image, information of designating an exposure value at thetime of the imaging, and/or information of designating the magnificationand the focal point of the imaged image.

Note that the imaging conditions such as the frame rate, exposure value,magnification, and focus described above may be appropriately designatedby the user, or may be automatically set by the control unit 11413 ofthe CCU 11201 on the basis of the acquired image signal. In the lattercase, a so-called auto exposure (AE) function, an auto focus (AF)function, and an auto white balance (AWB) function are provided in theendoscope 11100.

The camera head control unit 11405 controls the driving of the camerahead 11102 on the basis of the control signal from the CCU 11201received through the communication unit 11404.

The communication unit 11411 includes a communication apparatus fortransmitting and receiving various information items with respect to thecamera head 11102. The communication unit 11411 receives the imagesignal to be transmitted from the camera head 11102, through thetransmission cable 11400.

Furthermore, the communication unit 11411 transmits the control signalfor controlling the driving of the camera head 11102 to the camera head11102. The image signal and the control signal can be transmitted byelectrical communication, optical communication, or the like.

The image processing unit 11412 performs various image processing on theimage signal which is the RAW data transmitted from the camera head11102.

The control unit 11413 performs various types of control related toimaging of the surgical site or the like by the endoscope 11100 anddisplay of a captured image obtained by imaging of the surgical site orthe like. For example, the control unit 11413 generates the controlsignal for controlling the driving of the camera head 11102.

Furthermore, the control unit 11413 causes the display apparatus 11202to display the captured image of the surgery site or the like on thebasis of the image signal subjected to the image processing by the imageprocessing unit 11412. At this time, the control unit 11413 mayrecognize various objects in the captured image by using various imagerecognition technologies. For example, the control unit 11413 detectsthe shape, the color, or the like of the edge of the object included inthe captured image, and thus, it is possible to recognize a surgicaltool such as forceps, a specific biological portion, bleed, mist at thetime of using the energy treatment tool 11112, and the like When thecaptured image is displayed on the display apparatus 11202, the controlunit 11413 may display various surgery support information items to besuperimposed on the image of the surgery site, by using a recognitionresult. Surgery support information is displayed in a superimposedmanner and presented to the operator 11131, thereby reducing the burdenon the operator 11131 and allowing the operator 11131 to proceed withsurgery reliably.

The transmission cable 11400 connecting the camera head 11102 and theCCU 11201 together, is an electrical signal cable corresponding to thecommunication of the electrical signal, an optical fiber correspondingto the optical communication, or a composite cable thereof.

Here, in the illustrated example, the communication is performed in awired manner, by using the transmission cable 11400, but thecommunication between the camera head 11102 and the CCU 11201, may beperformed in a wireless manner.

An example of the endoscopic surgery system to which the technologyaccording to the present disclosure can be applied, has been described.The technology according to the present disclosure can be applied to(the imaging unit 11402 of) the camera head 11102 among theconfigurations described above. Specifically, the solid-state imagingelement 10 of FIG. 1 can be applied to (the imaging unit 11402 of) thecamera head 11102. By applying the technology according to the presentdisclosure to the imaging unit 11402, it is possible to increase theframe rate and obtain a more observable surgical site image, so that theoperator can reliably confirm the surgical site.

Note that, here, although an endoscopic surgery system has beendescribed as an example, the technology according to the presentdisclosure may be applied to, for example, a microscope surgery systemand the like.

Note that the embodiment of the present technology is not limited to theaforementioned embodiments, but various changes may be made within thescope not departing from the gist of the present technology.

Furthermore, the present technology can adopt the configurationdescribed below.

(1)

An imaging apparatus including:

a pixel array unit including a first pixel portion and a second pixelportion different from the first pixel portion, in which

each of the first pixel portion and the second pixel portion includes afirst photoelectric conversion unit and a second photoelectricconversion unit adjacent to the first photoelectric conversion unit, and

the pixel array unit includes

a first drive line connected to the first photoelectric conversion unitof the first pixel portion and the second pixel portion,

a second drive line connected to the second photoelectric conversionunit of the first pixel portion, and

a third drive line connected to the second photoelectric conversion unitof the second pixel portion.

(2)

The imaging apparatus according to (1), in which

the second drive line is nonconnected to the second photoelectricconversion unit of the second pixel portion.

(3)

The imaging apparatus according to (1) or (2), in which

the third drive line is nonconnected to the second photoelectricconversion unit of the first pixel portion.

(4)

The imaging apparatus according to any of (1) to (3), further including

an illuminance detection unit that detects illuminance in an imagingregion of the pixel array unit, in which

in a case where the illuminance detected by the illuminance detectionunit is smaller than a predetermined threshold value, in the first pixelportion, a pixel signal corresponding to the first photoelectricconversion unit and a pixel signal corresponding to the secondphotoelectric conversion unit are generated using the first drive lineand the second drive line, in a case where the illuminance detected bythe illuminance detection unit is larger than the predeterminedthreshold value, in the second pixel portion, a pixel signalcorresponding to the first photoelectric conversion unit and a pixelsignal corresponding to the second photoelectric conversion unit aregenerated using the first drive line and the third drive line, andmeanwhile, in the first pixel portion, a pixel signal corresponding tothe first photoelectric conversion unit and a pixel signal correspondingto the second photoelectric conversion unit are added up and generated.

(5)

The imaging apparatus according to (4), further including

an acquisition unit that acquires accuracy-related information relatedto accuracy of phase difference detection using the pixel signal, inwhich

a value indicated by the accuracy-related information acquired by theacquisition unit is used for determination with the predeterminedthreshold value together with a value indicated by the illuminance.

(6)

The imaging apparatus according to (5), in which

the accuracy-related information includes a luminance level in a targetregion in a target image frame.

(7)

The imaging apparatus according to (5) or (6), in which

the accuracy-related information includes a number of effective pixelsamong pixels used for phase difference detection.

(8)

The imaging apparatus according to any of (5) to (7), in which

the accuracy-related information includes a size of a region of interestin the target image frame.

(9)

The imaging apparatus according to any of (1) to (8), in which

the first pixel portion includes a pixel unit having one or morephotoelectric conversion units, and

the second pixel portion includes a pixel unit having one or morephotoelectric conversion units.

(10)

The imaging apparatus according to (9), in which

the first pixel portion has an even number of photoelectric conversionunits, and

the second pixel portion has an even number of photoelectric conversionunits.

(11)

The imaging apparatus according to (10), in which

the first pixel portion has two photoelectric conversion units, and

the second pixel portion has two photoelectric conversion units.

(12)

The imaging apparatus according to (10), in which

the first pixel portion has four photoelectric conversion units, and

the second pixel portion has four photoelectric conversion units.

(13)

The imaging apparatus according to any of (4) to (12), in which

the illuminance detection unit detects the illuminance on the basis ofexposure information.

(14)

The imaging apparatus according to (13), in which

the illuminance detection unit detects the illuminance on the basis ofan exposure amount obtained from an image frame preceding a target imageframe.

(15)

The imaging apparatus according to any of (4) to (14), in which

the illuminance detection unit is provided inside or outside theapparatus.

(16)

The imaging apparatus according to any of (4) to (15), further including

a drive control unit that controls driving of the first pixel portionand the second pixel portion on the basis of the illuminance detected bythe illuminance detection unit.

(17)

The imaging apparatus according to (16), further including

a correction unit that corrects the pixel signal used for phasedifference detection.

(18)

Electronic equipment including:

an imaging unit including:

a pixel array unit including a first pixel portion and a second pixelportion different from the first pixel portion,

in which

each of the first pixel portion and the second pixel portion includes afirst photoelectric conversion unit and a second photoelectricconversion unit adjacent to the first photoelectric conversion unit, and

the pixel array unit includes

a first drive line connected to the first photoelectric conversion unitof the first pixel portion and the second pixel portion,

a second drive line connected to the second photoelectric conversionunit of the first pixel portion, and

a third drive line connected to the second photoelectric conversion unitof the second pixel portion.

(19)

An imaging apparatus including:

a pixel array unit including a first pixel portion and a second pixelportion different from the first pixel portion; and

an illuminance detection unit that detects illuminance in an imagingregion of the pixel array unit,

in which

each of the first pixel portion and the second pixel portion includes afirst photoelectric conversion unit and a second photoelectricconversion unit adjacent to the first photoelectric conversion unit, ina case where the illuminance detected by the illuminance detection unitis smaller than a predetermined threshold value, in the first pixelportion and the second pixel portion, a pixel signal from the firstphotoelectric conversion unit and a pixel signal from the secondphotoelectric conversion unit are read, in a case where the illuminancedetected by the illuminance detection unit is larger than thepredetermined threshold value, in the second pixel portion, a pixelsignal from the first photoelectric conversion unit and a pixel signalfrom the second photoelectric conversion unit are read, and meanwhile,in the first pixel portion, a pixel signal from the first photoelectricconversion unit and a pixel signal from the second photoelectricconversion unit are added up and read.

REFERENCE SIGNS LIST

-   1A, 1B, 1C Imaging apparatus-   10 Solid-state imaging element-   11 Pixel array unit-   12 Vertical drive circuit-   13 Column signal processing circuit-   14 Horizontal drive circuit-   15 Output circuit-   16 Control circuit-   17 Input/output terminal-   21 Pixel drive line-   22 Vertical signal line-   100 Pixel-   100A, 100B Pixel-   120 Pixel-   120A, 120B, 120C, 120D Pixel-   111 On-chip lens-   112A, 112B, 112C, 112D Photodiode-   113 Color filter-   151 Comparator-   152 DAC-   200A, 200B, 200C Control unit-   211 Sensor drive control unit-   212 AE unit-   213 Luminance level detection unit-   214 Phase difference detection unit-   215 Counting unit-   216 ROI setting unit-   300 Signal processing unit-   311 Pixel correction unit-   312 Selector-   313 Image signal processing unit-   1000 Electronic equipment-   1012 Imaging unit

1. An imaging apparatus comprising: a pixel array unit including a firstpixel portion and a second pixel portion different from the first pixelportion, wherein each of the first pixel portion and the second pixelportion includes a first photoelectric conversion unit and a secondphotoelectric conversion unit adjacent to the first photoelectricconversion unit, and the pixel array unit includes a first drive lineconnected to the first photoelectric conversion unit of the first pixelportion and the second pixel portion, a second drive line connected tothe second photoelectric conversion unit of the first pixel portion, anda third drive line connected to the second photoelectric conversion unitof the second pixel portion.
 2. The imaging apparatus according to claim1, wherein the second drive line is nonconnected to the secondphotoelectric conversion unit of the second pixel portion.
 3. Theimaging apparatus according to claim 1, wherein the third drive line isnonconnected to the second photoelectric conversion unit of the firstpixel portion.
 4. The imaging apparatus according to claim 1, furthercomprising an illuminance detection unit that detects illuminance in animaging region of the pixel array unit, wherein in a case where theilluminance detected by the illuminance detection unit is smaller than apredetermined threshold value, in the first pixel portion, a pixelsignal corresponding to the first photoelectric conversion unit and apixel signal corresponding to the second photoelectric conversion unitare generated using the first drive line and the second drive line, in acase where the illuminance detected by the illuminance detection unit islarger than the predetermined threshold value, in the second pixelportion, a pixel signal corresponding to the first photoelectricconversion unit and a pixel signal corresponding to the secondphotoelectric conversion unit are generated using the first drive lineand the third drive line, and meanwhile, in the first pixel portion, apixel signal corresponding to the first photoelectric conversion unitand a pixel signal corresponding to the second photoelectric conversionunit are added up and generated.
 5. The imaging apparatus according toclaim 4, further comprising an acquisition unit that acquiresaccuracy-related information related to accuracy of phase differencedetection using the pixel signal, wherein a value indicated by theaccuracy-related information acquired by the acquisition unit is usedfor determination with the predetermined threshold value together with avalue indicated by the illuminance.
 6. The imaging apparatus accordingto claim 5, wherein the accuracy-related information includes aluminance level in a target region in a target image frame.
 7. Theimaging apparatus according to claim 5, wherein the accuracy-relatedinformation includes a number of effective pixels among pixels used forphase difference detection.
 8. The imaging apparatus according to claim5, wherein the accuracy-related information includes a size of a regionof interest in the target image frame.
 9. The imaging apparatusaccording to claim 1, wherein the first pixel portion includes a pixelunit having one or more photoelectric conversion units, and the secondpixel portion includes a pixel unit having one or more photoelectricconversion units.
 10. The imaging apparatus according to claim 9,wherein the first pixel portion has an even number of photoelectricconversion units, and the second pixel portion has an even number ofphotoelectric conversion units.
 11. The imaging apparatus according toclaim 10, wherein the first pixel portion has two photoelectricconversion units, and the second pixel portion has two photoelectricconversion units.
 12. The imaging apparatus according to claim 10,wherein the first pixel portion has four photoelectric conversion units,and the second pixel portion has four photoelectric conversion units.13. The imaging apparatus according to claim 4, wherein the illuminancedetection unit detects the illuminance on a basis of exposureinformation.
 14. The imaging apparatus according to claim 13, whereinthe illuminance detection unit detects the illuminance on a basis of anexposure amount obtained from an image frame preceding a target imageframe.
 15. The imaging apparatus according to claim 4, wherein theilluminance detection unit is provided inside or outside the apparatus.16. The imaging apparatus according to claim 4, further comprising adrive control unit that controls driving of the first pixel portion andthe second pixel portion on a basis of the illuminance detected by theilluminance detection unit.
 17. The imaging apparatus according to claim16, further comprising a correction unit that corrects the pixel signalused for phase difference detection.
 18. Electronic equipmentcomprising: an imaging unit including: a pixel array unit including afirst pixel portion and a second pixel portion different from the firstpixel portion, wherein each of the first pixel portion and the secondpixel portion includes a first photoelectric conversion unit and asecond photoelectric conversion unit adjacent to the first photoelectricconversion unit, and the pixel array unit includes a first drive lineconnected to the first photoelectric conversion unit of the first pixelportion and the second pixel portion, a second drive line connected tothe second photoelectric conversion unit of the first pixel portion, anda third drive line connected to the second photoelectric conversion unitof the second pixel portion.